Patent
High frequency cable, high frequency coil and method for manufacturing high frequency cable
| العنوان: | High frequency cable, high frequency coil and method for manufacturing high frequency cable |
|---|---|
| Patent Number: | 9,478,328 |
| تاريخ النشر: | October 25, 2016 |
| Appl. No: | 14/336507 |
| Application Filed: | July 21, 2014 |
| مستخلص: | A method for manufacturing a high frequency cable that includes covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer. |
| Inventors: | Shinmoto, Takashi (Noda, JP); Yoshida, Shotaro (Edogawa-ku, JP); Katayama, Shinji (Numazu, JP); Toda, Taikou (Hamamatsu, JP); Kato, Takamasa (Chiba, JP); Daibo, Masanori (Sakura, JP); Kawakawi, Akio (Numazu, JP) |
| Assignees: | FUJIKURA LTD. (Tokyo, JP) |
| Claim: | 1. A method for manufacturing a high frequency cable, comprising: covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer. |
| Patent References Cited: | 3463620 August 1969 Winter 3854193 December 1974 Yamaguchi 5223349 June 1993 Kudo 101202130 June 2008 201231257 May 2009 54-155915 December 1979 60-125357 July 1985 62-76216 April 1987 62-263978 November 1987 04-171609 June 1992 4-230905 August 1992 8-197281 August 1996 11-57848 March 1999 2001219214 August 2001 2002-150633 May 2002 2004-139832 May 2004 2005-108654 April 2005 2008-262808 October 2008 2009-129550 June 2009 2010-36237 February 2012 2006/046358 May 2006 |
| Other References: | Office Action issued by Korean Patent Office in Korean Patent Application 10-2012-7027195 mailed Jul. 18, 2014. cited by applicant Fujikura News No. 340, Nov. 11, 2009, pp. 1-2 with (English translation). cited by applicant Office Action issued by the Japanese Patent Office in Japanese Application No. 2010-549365 dated Feb. 5, 2013. cited by applicant Office Action issued by Chinese Patent Office in Chinese Application No. 201180015433.9 mailed Feb. 12, 2014. cited by applicant Ma Yong-qing, et al., “Bonding mechanism, microstructure and properties of the bimetallic wires by clad-drawing”, Functional Material, 2009, vol. 40, p. 94-97. cited by applicant |
| Primary Examiner: | Cazan, Livius R |
| Attorney, Agent or Firm: | Sughrue Mion, PLLC |
| رقم الانضمام: | edspgr.09478328 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |