Patent
Semiconductor device having a bulge portion and manufacturing method therefor
| العنوان: | Semiconductor device having a bulge portion and manufacturing method therefor |
|---|---|
| Patent Number: | 9,320,173 |
| تاريخ النشر: | April 19, 2016 |
| Appl. No: | 14/374363 |
| Application Filed: | February 18, 2013 |
| مستخلص: | A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin. |
| Inventors: | Yamamoto, Kei (Tokyo, JP); Tada, Kazuhiro (Tokyo, JP) |
| Assignees: | Mitsubishi Electric Corporation (Tokyo, JP) |
| Claim: | 1. A semiconductor device comprising: a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins; an insulation layer formed on the second major plane of the base plate; a circuit pattern fixed to the insulation layer; a semiconductor element connected to the circuit pattern; and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element, wherein the bulge portion formed on the first major plane continuously encircles the plurality of fins, the base plate has a widthwise margin on an outer peripheral edge of the first major plane of the base plate, the bulge portion is formed on the widthwise margin and divides the widthwise margin into an outer widthwise margin arranged outside of the bulge portion and an inner widthwise margin arranged inside of the bulge portion, and the sealing resin covers an outer peripheral side face of the bulge portion and the outer widthwise margin. |
| Claim: | 2. The semiconductor device of claim 1 , wherein the plurality of fins are arranged in a certain direction. |
| Claim: | 3. The semiconductor device of claim 2 , wherein each of the plurality of fins has a slit formed therein to penetrate in the thickness direction of the fins. |
| Claim: | 4. The semiconductor device of claim 3 , wherein the respective slits formed in the plurality of fins are arranged in a line. |
| Claim: | 5. The semiconductor device of claim 1 , wherein the insulation layer contains inorganic powder. |
| Claim: | 6. The semiconductor device of claim 1 , wherein a metal plate is fitted into the base plate. |
| Claim: | 7. The semiconductor device of claim 1 , wherein at least part of the semiconductor elements is constituted with a wide bandgap semiconductor. |
| Claim: | 8. The semiconductor device of claim 7 , wherein the wide bandgap semiconductor is a semiconductor formed of any of silicon carbide, a gallium-nitride-based material, and diamond. |
| Claim: | 9. A method of manufacturing a semiconductor device, the method comprising: forming integrally a base plate having a plurality of fins held upright on the base plate and a bulge portion formed on the base plate to encircle continuously the plurality of fins and to have a widthwise margin on an outer peripheral edge of the base plate, the bulge portion being formed on the widthwise margin and dividing the widthwise margin into an outer widthwise margin arranged outside of the bulge portion and an inner widthwise margin arranged inside of the bulge portion; fixing a semiconductor element to the base plate; placing the base plate into a molding die provided with a placing stage at a position higher than the bottom of the molding die so that the bulge portion is brought into contact with the placing stage with the plurality of fins down; injecting a molding resin into the molding die in which the base plate is placed to cover an outer peripheral side face of the bulge portion and the outer widthwise margin; and curing the injected molding resin by heating. |
| Claim: | 10. The semiconductor device of claim 1 , wherein the bulge portion has a narrower width at a position closer to its top. |
| Claim: | 11. The semiconductor device of claim 1 , wherein the widthwise margin has a constant width from the outer peripheral edge of the base plate. |
| Claim: | 12. The semiconductor device of claim 1 , wherein the bulge portion is formed in the middle of the widthwise margin. |
| Claim: | 13. The semiconductor device of claim 1 , wherein the outer widthwise margin and the inner widthwise margin have different widths. |
| Patent References Cited: | 5533257 July 1996 Romero et al. 5542146 August 1996 Hoekstra et al. 8659147 February 2014 Mitsui et al. 2012/0112236 May 2012 Higuma et al. 4-129253 April 1992 8 298299 November 1996 11-150216 June 1999 2002-110867 April 2002 2003 174129 June 2003 2009 33065 February 2009 2009 177038 August 2009 2010 199494 September 2010 2011 119488 June 2011 2011 238644 November 2011 2011-258594 December 2011 2012-28421 February 2012 2012 28561 February 2012 2012 164763 August 2012 2012 174734 September 2012 |
| Other References: | International Search Report Issued May 7, 2013 in PCT/JP13/053811 Filed Feb. 18, 2013. cited by applicant U.S. Appl. No. 14/370,803, filed Jul. 7, 2014, Yamamoto, et al. cited by applicant Office Action issued Aug. 25, 2015 in Japanese Patent Application No. 2014-500698 (with Partial English translation). cited by applicant Office Action issued Dec. 9, 2015 in German Patent Application No. 11 2012 005 791.0 (with English Translation). cited by applicant |
| Primary Examiner: | Williams, Alexander Oscar |
| Attorney, Agent or Firm: | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| رقم الانضمام: | edspgr.09320173 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |