Patent
Gas diffusion electrode assembly, bonding method for gas diffusion electrodes, and electrolyzer comprising gas diffusion electrodes
| العنوان: | Gas diffusion electrode assembly, bonding method for gas diffusion electrodes, and electrolyzer comprising gas diffusion electrodes |
|---|---|
| Patent Number: | 7,569,083 |
| تاريخ النشر: | August 04, 2009 |
| Appl. No: | 12/216232 |
| Application Filed: | July 01, 2008 |
| مستخلص: | In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes. |
| Inventors: | Katayama, Shinji (Tamano, JP); Asaumi, Kiyohito (Tamano, JP); Aikawa, Hiroaki (Kawasaki, JP); Osakabe, Tsugiyoshi (Nagoya, JP); Hamamori, Mitsuharu (Nagoya, JP); Kimura, Tatsuhito (Yokohama, JP); Saiki, Koji (Toyonaka, JP); Nonomura, Kenji (Kakogawa, JP); Okada, Naoya (Tokuyama, JP); Ichinose, Osamu (Takaishi, JP) |
| Assignees: | Chlorine Engineers Corp. Ltd. (Tokyo, JP), Tosoh Corporation (Shin-Nanyo-Shi), Mitsui Chemicals, Inc. (Tokyo, JP), Toagosei Co., Ltd. (Tokyo, JP), Kaneka Corporation (Osaka-Shi, JP), Asahi Glass Company, Limited (Tokyo, JP), Asahi Kasei Chemicals Corporation (Tokyo, JP), Daiso Co., Ltd. (Osaka-Shi, JP), Tokuyama Corporation (Shunan-Shi, JP) |
| Claim: | 1. A bonding method for a gas diffusion electrode assembly, characterized in that a covering sheet is covered on a junction where gas diffusion electrodes are bonded together, and an adhesive composition containing a corrosion-resistant synthetic resin is coated on said covering sheet for bonding. |
| Claim: | 2. The bonding method for a gas diffusion electrode assembly according to claim 1 , characterized in that either one of the surface of said junction to be bonded to said covering sheet and the surfaces of said covering sheet to be bonded to said junction, is previously impregnated with a corrosion-resistant synthetic resin containing solution having a synthetic resin concentration lower than that of said adhesive composition containing a corrosion-resistant synthetic resin. |
| Claim: | 3. The bonding method for a gas diffusion electrode assembly according to claim 2 , characterized in that a filling agent is filled in a gap formed between said gas diffusion electrodes and said covering sheet. |
| Claim: | 4. The bonding method for a gas diffusion electrode assembly according to claim 2 , characterized in that said covering sheet is microporous on at least the surface thereof. |
| Claim: | 5. The bonding method for a gas diffusion electrode assembly according to claim 2 , characterized in that said corrosion-resistant synthetic resin is a homopolymer or copolymer of tetrafluoroethylene. |
| Claim: | 6. The bonding method for a gas diffusion electrode assembly according to claim 1 , characterized in that said corrosion-resistant synthetic resin is a homopolymer or copolymer of tetrafluoroethylene. |
| Claim: | 7. A sealing method for a gas diffusion electrode assembly, characterized in that a sealing material containing an electrically conductive carbonaceous material and a fluororesin is filled in a junction of gas diffusion electrodes, so that said sealing material is heat treated for bonding. |
| Claim: | 8. The sealing method for a gas diffusion electrode assembly according to claim 7 , characterized in that at said junction of gas diffusion electrodes, a collector is exposed on a periphery thereof. |
| Claim: | 9. The sealing method for a gas diffusion electrode assembly according to claim 7 , characterized in that said sealing material is composed of the same constituent as the constituent of either one of a gas supply layer or a reactive layer of the gas diffusion electrodes to be bonded together. |
| Claim: | 10. The sealing method for a gas diffusion electrode assembly according to claim 7 , characterized in that said sealing material contains a catalyst substance in a gas diffusion electrode. |
| Claim: | 11. The sealing method for a gas diffusion electrode assembly according to claim 7 , characterized in that the junction of a gas diffusion electrode is a junction of said gas diffusion electrode with a cathode chamber collector frame, and a gap between said gas diffusion electrode and said cathode chamber collector frame is sealed up. |
| Claim: | 12. The sealing method for a gas diffusion electrode assembly according to claim 7 , characterized in that the junction of a gas diffusion electrode is a junction of said gas diffusion electrode with a gas diffusion electrode adjacent thereto, and a gap between adjacent gas diffusion electrodes is sealed up. |
| Claim: | 13. A repairing method for a gas diffusion electrode, characterized in that a sealing material containing an electrically conductive carbonaceous material and a fluororesin is filled in a defective portion of said gas diffusion electrode, so that said defective portion is repaired by heat treatment of said sealing material. |
| Current U.S. Class: | 296/234 |
| Patent References Cited: | 4663013 May 1987 Kumagai et al. 6054228 April 2000 Cisar et al. 6372102 April 2002 Sakata et al. 6423194 July 2002 Furuya 7195690 March 2007 Mekala et al. 2004/0038808 February 2004 Hampden-Smith et al. 2004/0101739 May 2004 Enjoji et al. 1 029 946 August 2000 58-204030 November 1983 2000-119880 April 2000 2000-199094 July 2000 2000-239879 September 2000 2000-239881 September 2000 2000-273679 October 2000 |
| Other References: | Partial European Search Report dated Dec. 27, 2006, issued in corresponding European patent application No. 04 00 7850.3. cited by other Japanese Office Action dated Sep. 28, 2007 (mailing date), issued in corresponding Japanese Patent Application No. 2003-093992. cited by other |
| Primary Examiner: | Bell, Bruce F |
| Attorney, Agent or Firm: | Westerman, Hattori, Daniels & Adrian, LLP. |
| رقم الانضمام: | edspgr.07569083 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |