التفاصيل البيبلوغرافية
| العنوان: |
Method and apparatus for measuring shape of bumps |
| Document Number: |
20050129304 |
| تاريخ النشر: |
June 16, 2005 |
| Appl. No: |
10/964690 |
| Application Filed: |
October 15, 2004 |
| مستخلص: |
The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit. |
| Inventors: |
Sasazawa, Hideaki (Yokohama, JP); Nomoto, Mineo (Yokohama, JP); Yamaga, Masatoshi (Atsugi, JP); Iwata, Chikara (Sagamihara, JP); Uehara, Masashi (Zama, JP) |
| Claim: |
1. An apparatus for measuring a shape of bumps, comprising: a stage on which a board arranged thereon with a plurality of bumps to be measured is placed and moved; an illumination optical system which illuminates the bumps arranged on said board moved by said stage with illumination light using an illumination optical axis having a low tilt angle to a surface of said board; a detection optical system which condenses the reflected light from the bumps illuminated by said illumination optical system for detection of image signals of the bumps using a detection optical axis having a tilt angle higher than that of said illumination optical axis to the surface of said board; an image processing unit which A/D converts the image signals of the bumps detected by said detection optical system to obtain digital image signals of the bumps, calculates an outline of at least a tip and a base of each of the bumps based on the image signals of at least the tip and the base of each of the bumps obtained based on the digital image signals of the bumps, and calculates geometric characteristics including at least a position and a height of each of the bumps are calculated based on the outline of at least the tip and the base of each of the bumps; and a main control unit which allows a display unit to display thereon information on the geometric characteristics of each of the bumps calculated by said image processing unit. |
| Claim: |
2. The apparatus according to claim 1, wherein the geometric characteristics of each of the bumps calculated in said image processing unit further includes a base diameter of each of the bumps. |
| Claim: |
3. The apparatus according to claim 1, wherein in said image processing unit, quality of each of the bumps is determined based on the further calculated geometric characteristics of the bumps and said determination results are provided to said main control unit. |
| Claim: |
4. The apparatus according to claim 1, wherein said detection optical system has a condenser lens for condensing reflected light from each bump and a linear image sensor for receiving the reflected light from each bump condensed by said condenser lens and converting the reflected light into an image signal. |
| Claim: |
5. The apparatus according to claim 1, wherein said illumination optical system is configured such that each of said bumps is illuminated with said illumination light from a plurality of directions. |
| Claim: |
6. The apparatus according to claim 1, wherein said illumination optical system emits diffused illumination light as said illumination light. |
| Claim: |
7. An apparatus for measuring a shape of bumps, comprising: a stage on which a board arranged thereon with a plurality of bumps to be measured is placed and moved; an illumination optical system which illuminates the bumps arranged on said board moved by said stage with illumination light using an illumination optical axis having a low tilt angle to a surface of said board; a detection optical system which condenses the reflected light from the bumps illuminated by said illumination optical system for detection of image signals of the bumps using a detection optical axis having a tilt angle higher than that of said illumination optical axis to the surface of said board; an image processing unit which A/D converts the image signals of the bumps detected by said detection optical system to obtain digital image signals of the bumps, calculates an outline of at least a tip and a base of each of the bumps based on the image signals of at least the tip and base of each of the bumps obtained based on the digital image signals of the bumps, calculates geometric characteristics including at least a position and a height of each of the bumps are calculated based on the outline of at least the tip and the base of each of the bumps, and determines quality of each of the bumps based on the calculated geometric characteristics of the bumps; and a main control unit which outputs information on the quality of each of the bumps determined by said image processing unit. |
| Claim: |
8. The apparatus according to claim 7, wherein the geometric characteristics of the bumps calculated in said image processing unit further includes a base diameter of each of the bumps. |
| Claim: |
9. The apparatus according to claim 7, wherein said main control unit is configured such that information on the geometric characteristics of the bumps calculated by said image processing unit is displayed on a display unit. |
| Claim: |
10. The apparatus according to claim 7, wherein in said main control unit, the information on the geometric characteristics of each of the bumps displayed on said display unit includes at least one of distribution in the geometric characteristics of the bumps on the board, occurrence frequency of the bumps with respect to the geometric characteristics, and variation with time in the geometric characteristics of the bumps. |
| Claim: |
11. The apparatus according to claim 7, further comprising an image data preservation unit for preserving the A/D converted image signals, which are obtained from said image processing unit, of at least the bump determined to be defective. |
| Claim: |
12. The apparatus according to claim 7, wherein in said illumination optical system, said illumination light is white light or light having a wavelength of 570 nm or less. |
| Claim: |
13. The apparatus according to claim 7, wherein said detection optical system includes a condenser lens for condensing reflected light of each bump, and a linear image sensor for receiving the reflected light, of each bump, condensed by said condenser lens and for converting the reflected light into image signals. |
| Claim: |
14. The apparatus according to claim 7, wherein said illumination optical system is configured such that each of said bumps is illuminated with said illumination light from a plurality of directions. |
| Claim: |
15. The apparatus according to claim 7, wherein said illumination optical system emits diffused illumination light as said illumination light. |
| Claim: |
16. The apparatus according to claim 13, wherein said linear image sensor includes a first linear image sensor for receiving light focusing on a tip of each bump and a second linear image sensor for receiving light focusing on a base of each bump. |
| Claim: |
17. The apparatus according to claim 13, wherein said illumination optical system is configured such that light is emitted to each bump in a strip-like or slit-like shape corresponding to a light-receiving region of said linear image sensor. |
| Claim: |
18. A method for measuring a shape of bumps, comprising the steps of: illuminating bumps arranged on a board from a first direction having a lower angle with respect to a surface of said board; detecting reflected light from said bumps illuminated from said first angle direction in a second direction having an angle higher than that in said first direction with respect to the surface of said board so as to obtain image signals of said bumps; processing the detected image signals of said bumps to calculate geometric characteristics including information on at least a position and a height of each of said bumps; and displaying the information on the calculated geometric characteristics of said bumps on a screen. |
| Claim: |
19. The method according to claim 18, wherein the step of illuminating said board from the first angle direction and the step of detecting said reflected light in the second angle direction to obtain the image signals are performed while said board are continuously moved at least in one direction. |
| Claim: |
20. The method according to claim 18, wherein the step of displaying information on said screen displays on said screen information on the distribution of the height, bottom diameter and bottom position of each of said bumps on said board as the information on the geometrical characteristics of said bumps. |
| Claim: |
21. The method according to claim 18, wherein the step of displaying information on said screen displays on said screen information on each defect of the height, bottom diameter and bottom position of each of said bumps on said board as the information on the geometrical characteristics of said bumps. |
| Claim: |
22. The method according to claim 18, wherein the geometric characteristics including at least the position and the height of each of said bumps are calculated by calculating an outline of at least the tip and the base of each of the bumps based on the image signal of at least the tip and the base of each of said bumps among the detected image signals of said bumps, and calculating geometric characteristics including at least the position and the height of each of said bumps based on the calculated outline of at least the tip and the base of each of said bumps. |
| Current U.S. Class: |
382150/000 |
| رقم الانضمام: |
edspap.20050129304 |
| قاعدة البيانات: |
USPTO Patent Applications |
