دورية أكاديمية

Challenges in On-Chip Antenna Design and Integration With RF Receiver Front-End Circuitry in Nanoscale CMOS for 5G Communication Systems

التفاصيل البيبلوغرافية
العنوان: Challenges in On-Chip Antenna Design and Integration With RF Receiver Front-End Circuitry in Nanoscale CMOS for 5G Communication Systems
المؤلفون: Mahsa Keshavarz Hedayati, Abdolali Abdipour, Reza Sarraf Shirazi, Max J. Ammann, Matthias John, Cagri Cetintepe, Robert Bogdan Staszewski
المصدر: IEEE Access, Vol 7, Pp 43190-43204 (2019)
بيانات النشر: IEEE, 2019.
سنة النشر: 2019
المجموعة: LCC:Electrical engineering. Electronics. Nuclear engineering
مصطلحات موضوعية: 5G, mm-wave, nanometer-scale CMOS, 28 nm CMOS, active integrated antenna (AIA), antenna-on-chip (AoC), Electrical engineering. Electronics. Nuclear engineering, TK1-9971
الوصف: This paper investigates design considerations and challenges of integrating on-chip antennas in nanoscale CMOS technology at millimeter-wave (mm-wave) to achieve a compact front-end receiver for 5G communication systems. Solutions to overcome these challenges are offered and realized in digital 28-nm CMOS. A monolithic on-chip antenna is designed and optimized in the presence of rigorous metal density rules and other back-end-of-the-line (BEoL) challenges of the nanoscale technology. The proposed antenna structure further exploits ground metallization on a PCB board acting as a reflector to increase its radiation efficiency and power gain by 37.3% and 9.8 dB, respectively, while decreasing the silicon area up to 30% compared to the previous works. The antenna is directly matched to a two-stage low noise amplifier (LNA) in a synergetic way as to give rise to an active integrated antenna (AIA) in order to avoid additional matching or interconnect losses. The LNA is followed by a double-balanced folded Gilbert cell mixer, which produces a lower intermediate frequency (IF) such that no probing is required for measurements. The measured total gain of the AIA is 14 dBi. Its total core area is 0.83 mm2 while the total chip area, including the pad frame, is 1.55 × 0.85 mm2.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2169-3536
العلاقة: https://ieeexplore.ieee.org/document/8668762Test/; https://doaj.org/toc/2169-3536Test
DOI: 10.1109/ACCESS.2019.2905861
الوصول الحر: https://doaj.org/article/d53052c09bf548918cf2a3d7f4a46915Test
رقم الانضمام: edsdoj.53052c09bf548918cf2a3d7f4a46915
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:21693536
DOI:10.1109/ACCESS.2019.2905861