دورية أكاديمية
Analysis of Residual Stress in Polycrystalline Silver Thin Films by X-Ray Diffraction
| العنوان: | Analysis of Residual Stress in Polycrystalline Silver Thin Films by X-Ray Diffraction |
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| المؤلفون: | Alford, T. L., Zeng, Yuxiao, Zou, Y. L., Deng, F., Lau, S. S., Laursen, T., Manfred Ullrich, B. |
| المصدر: | MRS Proceedings ; volume 472 ; ISSN 0272-9172 1946-4274 |
| بيانات النشر: | Springer Science and Business Media LLC |
| سنة النشر: | 1997 |
| مصطلحات موضوعية: | Microbiology |
| الوصف: | The stress state of evaporated Ag films prepared on Ti underlayers before and after encapsulation process has been studied by x-ray diffraction using a “sin 2 ψ” technique. A low tensile stress of approximately 61 MPa was measured in the as-deposited Ag films. The stress was caused by nonequilibrium growth during film deposition and resulted in a lattice tension state in the film plane and a lattice compression state along the film normal. Thermal mismatch stress was produced by the encapsulation process at 600 °C, but most of this stress relaxed during the cooling stage, and a residual tensile stress of ∼ 320 MPa in the film plane was determined. |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1557/proc-472-293 |
| الإتاحة: | https://doi.org/10.1557/proc-472-293Test https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400232181Test |
| حقوق: | https://www.cambridge.org/core/termsTest |
| رقم الانضمام: | edsbas.CA36F80C |
| قاعدة البيانات: | BASE |
| DOI: | 10.1557/proc-472-293 |
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