مؤتمر
Novel low k Dielectric materials for nano device interconnect technology
العنوان: | Novel low k Dielectric materials for nano device interconnect technology |
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المؤلفون: | Nguyen, Son Van, Shobha, H., Haigh, T., Chen, J., Lee, J., Nogami, T., Liniger, E., Cohen, S., Hu, C. K., Huang, H., Yao, Y., Canaperi, D., Peethala, B., Standaert, T., Bonilla, G. |
المصدر: | 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) |
بيانات النشر: | IEEE |
سنة النشر: | 2020 |
نوع الوثيقة: | conference object |
اللغة: | unknown |
DOI: | 10.1109/vlsi-tsa48913.2020.9203631 |
الإتاحة: | https://doi.org/10.1109/vlsi-tsa48913.2020.9203631Test http://xplorestaging.ieee.org/ielx7/9199081/9203570/09203631.pdf?arnumber=9203631Test |
حقوق: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.htmlTest ; https://doi.org/10.15223/policy-029Test ; https://doi.org/10.15223/policy-037Test |
رقم الانضمام: | edsbas.AC21DD15 |
قاعدة البيانات: | BASE |
DOI: | 10.1109/vlsi-tsa48913.2020.9203631 |
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