دورية أكاديمية
Sensitive Strain Measurements of Bonded SOI Films Using MoirÉ
| العنوان: | Sensitive Strain Measurements of Bonded SOI Films Using MoirÉ |
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| المؤلفون: | Meinhold, M., Jung, J.-W., Antoniadis, D. |
| المصدر: | IEEE Transactions on Semiconductor Manufacturing ; volume 17, issue 1, page 35-41 ; ISSN 0894-6507 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE) |
| سنة النشر: | 2004 |
| مصطلحات موضوعية: | Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1109/tsm.2003.823259 |
| الإتاحة: | https://doi.org/10.1109/tsm.2003.823259Test http://xplorestaging.ieee.org/ielx5/66/28306/01265766.pdf?arnumber=1265766Test |
| حقوق: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.htmlTest |
| رقم الانضمام: | edsbas.89AA62C7 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/tsm.2003.823259 |
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