دورية أكاديمية

Dependence of process damage on GaN channel thickness in AlGaN/GaN high-electron-mobility transistors with back-barrier layers

التفاصيل البيبلوغرافية
العنوان: Dependence of process damage on GaN channel thickness in AlGaN/GaN high-electron-mobility transistors with back-barrier layers
المؤلفون: Ito, Yoshikaze, Tamai, Seita, Hoshi, Takuya, Gotow, Takahiro, Miyamoto, Yasuyuki
المصدر: Japanese Journal of Applied Physics ; volume 62, issue SC, page SC1048 ; ISSN 0021-4922 1347-4065
بيانات النشر: IOP Publishing
سنة النشر: 2023
الوصف: In this study, AlGaN/GaN high-electron-mobility transistors with 65 and 38 nm channel layers and back-barrier layers were fabricated. The isolation process resulted in damage related to the thickness of the channel layer, which deteriorated properties such as sheet resistance R sh and transconductance g m . These were attributed to the surface oxidation of the AlGaN barrier, and the simulation results showed that the channel layer thickness changed the dependence of R sh on the trap level density; however, the calculated changes were smaller than the observed changes. In the range of gate lengths we produced, suppression of the short-channel effect by the back barrier layer was confirmed. However, no significant change in the channel layer thickness was observed.
نوع الوثيقة: article in journal/newspaper
اللغة: unknown
DOI: 10.35848/1347-4065/acb2d5
DOI: 10.35848/1347-4065/acb2d5/pdf
الإتاحة: https://doi.org/10.35848/1347-4065/acb2d5Test
حقوق: https://iopscience.iop.org/page/copyrightTest ; https://iopscience.iop.org/info/page/text-and-data-miningTest
رقم الانضمام: edsbas.76737797
قاعدة البيانات: BASE