مؤتمر
Research on heat dissipation performance of double-sided cooling IGBT module
العنوان: | Research on heat dissipation performance of double-sided cooling IGBT module |
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المؤلفون: | Huang, Zuoyi, An, Tong, Qin, Fei, Gong, Yanpeng, Dai, Yanwei, Wang, Zhen |
المساهمون: | National Natural Science Foundation of China |
المصدر: | 2023 24th International Conference on Electronic Packaging Technology (ICEPT) |
بيانات النشر: | IEEE |
سنة النشر: | 2023 |
نوع الوثيقة: | conference object |
اللغة: | unknown |
DOI: | 10.1109/icept59018.2023.10492352 |
الإتاحة: | https://doi.org/10.1109/icept59018.2023.10492352Test http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492352.pdf?arnumber=10492352Test |
حقوق: | https://doi.org/10.15223/policy-029Test ; https://doi.org/10.15223/policy-037Test |
رقم الانضمام: | edsbas.6249527F |
قاعدة البيانات: | BASE |
DOI: | 10.1109/icept59018.2023.10492352 |
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