Bonding of the Inner Tracker Silicon Microstrip Modules

التفاصيل البيبلوغرافية
العنوان: Bonding of the Inner Tracker Silicon Microstrip Modules
المؤلفون: Bosi, Filippo, Brasolin, S, Brianzi, Mirko, Cariola, P, Costa, Salvatore, Demaria, Natale, Dumitrache, Floarea, Farano, R, Fiore, Luigi, Galet, G, Giudice, Nunzio, Kaminski, A, Mammini, Paolo, Manolescu, Florentina, Pantano, Devis, Profeti, Alessandro, Raimondo, F S, Saizu, Mirela Angela, Scarlini, Enrico, Tempesta, Paolo, Tessaro, Mario
سنة النشر: 2008
مصطلحات موضوعية: Detectors and Experimental Techniques
الوصف: Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\sim$0.015 \% is observed.
اللغة: English
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=od________65::8afeb8e8aa827b9ed65eb887c5be0007Test
http://cds.cern.ch/record/1127568Test
حقوق: OPEN
رقم الانضمام: edsair.od........65..8afeb8e8aa827b9ed65eb887c5be0007
قاعدة البيانات: OpenAIRE