Co-design of Thermal Management with System Architecture and Power Management for 3D ICs
| العنوان: | Co-design of Thermal Management with System Architecture and Power Management for 3D ICs |
|---|---|
| المؤلفون: | Rishav Roy, Shidhartha Das, Benoit Labbe, Rahul Mathur, Supreet Jeloka |
| المصدر: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| الوصول الحر: | https://explore.openaire.eu/search/publication?articleId=doi_________::cb9c3a11a700dd3e1ba235d2e942c146Test https://doi.org/10.1109/ectc51906.2022.00044Test |
| حقوق: | CLOSED |
| رقم الانضمام: | edsair.doi...........cb9c3a11a700dd3e1ba235d2e942c146 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |