مؤتمر
Reliability analysis of bumping schemes under chip package interaction
| العنوان: | Reliability analysis of bumping schemes under chip package interaction |
|---|---|
| المؤلفون: | Kappaganthu, Sri Ramakanth, Karmarkar, Aditya, Xu, Xiaopeng, El Sayed, Karim, Avci, Ibrahim, Chawla, Vikas, Mishra, Bikash, Kucherov, Andrey, Zhou, Weixing, Johnson, Mark, Balasingam, Pratheep |
| المصدر: | IEEE International Interconnect Technology Conference |
| بيانات النشر: | IEEE |
| سنة النشر: | 2014 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/iitc.2014.6831850 |
| الإتاحة: | https://doi.org/10.1109/iitc.2014.6831850Test http://xplorestaging.ieee.org/ielx7/6826038/6831822/06831850.pdf?arnumber=6831850Test |
| رقم الانضمام: | edsbas.591F3825 |
| قاعدة البيانات: | BASE |
| ResultId |
1 |
|---|---|
| Header |
edsbas BASE edsbas.591F3825 800 3 Conference conference 799.518249511719 |
| PLink |
https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsbas&AN=edsbas.591F3825&custid=s6537998&authtype=sso |
| FullText |
Array
(
[Availability] => 0
)
Array ( [0] => Array ( [Url] => https://doi.org/10.1109/iitc.2014.6831850# [Name] => EDS - BASE [Category] => fullText [Text] => View record in BASE [MouseOverText] => View record in BASE ) ) |
| Items |
Array
(
[Name] => Title
[Label] => Title
[Group] => Ti
[Data] => Reliability analysis of bumping schemes under chip package interaction
)
Array ( [Name] => Author [Label] => Authors [Group] => Au [Data] => <searchLink fieldCode="AR" term="%22Kappaganthu%2C+Sri+Ramakanth%22">Kappaganthu, Sri Ramakanth</searchLink><br /><searchLink fieldCode="AR" term="%22Karmarkar%2C+Aditya%22">Karmarkar, Aditya</searchLink><br /><searchLink fieldCode="AR" term="%22Xu%2C+Xiaopeng%22">Xu, Xiaopeng</searchLink><br /><searchLink fieldCode="AR" term="%22El+Sayed%2C+Karim%22">El Sayed, Karim</searchLink><br /><searchLink fieldCode="AR" term="%22Avci%2C+Ibrahim%22">Avci, Ibrahim</searchLink><br /><searchLink fieldCode="AR" term="%22Chawla%2C+Vikas%22">Chawla, Vikas</searchLink><br /><searchLink fieldCode="AR" term="%22Mishra%2C+Bikash%22">Mishra, Bikash</searchLink><br /><searchLink fieldCode="AR" term="%22Kucherov%2C+Andrey%22">Kucherov, Andrey</searchLink><br /><searchLink fieldCode="AR" term="%22Zhou%2C+Weixing%22">Zhou, Weixing</searchLink><br /><searchLink fieldCode="AR" term="%22Johnson%2C+Mark%22">Johnson, Mark</searchLink><br /><searchLink fieldCode="AR" term="%22Balasingam%2C+Pratheep%22">Balasingam, Pratheep</searchLink> ) Array ( [Name] => TitleSource [Label] => Source [Group] => Src [Data] => IEEE International Interconnect Technology Conference ) Array ( [Name] => Publisher [Label] => Publisher Information [Group] => PubInfo [Data] => IEEE ) Array ( [Name] => DatePubCY [Label] => Publication Year [Group] => Date [Data] => 2014 ) Array ( [Name] => TypeDocument [Label] => Document Type [Group] => TypDoc [Data] => conference object ) Array ( [Name] => Language [Label] => Language [Group] => Lang [Data] => unknown ) Array ( [Name] => DOI [Label] => DOI [Group] => ID [Data] => 10.1109/iitc.2014.6831850 ) Array ( [Name] => URL [Label] => Availability [Group] => URL [Data] => https://doi.org/10.1109/iitc.2014.6831850<br />http://xplorestaging.ieee.org/ielx7/6826038/6831822/06831850.pdf?arnumber=6831850 ) Array ( [Name] => AN [Label] => Accession Number [Group] => ID [Data] => edsbas.591F3825 ) |
| RecordInfo |
Array
(
[BibEntity] => Array
(
[Identifiers] => Array
(
[0] => Array
(
[Type] => doi
[Value] => 10.1109/iitc.2014.6831850
)
)
[Languages] => Array
(
[0] => Array
(
[Text] => unknown
)
)
[Titles] => Array
(
[0] => Array
(
[TitleFull] => Reliability analysis of bumping schemes under chip package interaction
[Type] => main
)
)
)
[BibRelationships] => Array
(
[HasContributorRelationships] => Array
(
[0] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Kappaganthu, Sri Ramakanth
)
)
)
[1] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Karmarkar, Aditya
)
)
)
[2] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Xu, Xiaopeng
)
)
)
[3] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => El Sayed, Karim
)
)
)
[4] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Avci, Ibrahim
)
)
)
[5] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Chawla, Vikas
)
)
)
[6] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Mishra, Bikash
)
)
)
[7] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Kucherov, Andrey
)
)
)
[8] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Zhou, Weixing
)
)
)
[9] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Johnson, Mark
)
)
)
[10] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Balasingam, Pratheep
)
)
)
)
[IsPartOfRelationships] => Array
(
[0] => Array
(
[BibEntity] => Array
(
[Dates] => Array
(
[0] => Array
(
[D] => 01
[M] => 01
[Type] => published
[Y] => 2014
)
)
[Identifiers] => Array
(
[0] => Array
(
[Type] => issn-locals
[Value] => edsbas
)
)
[Titles] => Array
(
[0] => Array
(
[TitleFull] => IEEE International Interconnect Technology Conference
[Type] => main
)
)
)
)
)
)
)
|
| IllustrationInfo |