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1دورية أكاديمية
المؤلفون: Kai Fu, Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, Madhavan Swaminathan, Wen-Yan Yin
المصدر: IEEE Access, Vol 6, Pp 75278-75292 (2018)
مصطلحات موضوعية: Passive equalizer, through-silicon vias (TSVs), on-interposer interconnects, three-dimensional integrated circuits (3-D ICs), peak distortion analysis, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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المؤلفون: Wen-Yan Yin, Gaofeng Wang, Wen-Sheng Zhao, Kai Fu, Madhavan Swaminathan, Da-Wei Wang
المصدر: IEEE Access, Vol 6, Pp 75278-75292 (2018)
مصطلحات موضوعية: General Computer Science, Computer science, Equalizer, through-silicon vias (TSVs), 02 engineering and technology, Integrated circuit, Topology, 01 natural sciences, Transfer function, Capacitance, law.invention, three-dimensional integrated circuits (3-D ICs), law, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, General Materials Science, Passive equalizer, on-interposer interconnects, 010302 applied physics, General Engineering, 020206 networking & telecommunications, Single antenna interference cancellation, Equivalent circuit, peak distortion analysis, lcsh:Electrical engineering. Electronics. Nuclear engineering, lcsh:TK1-9971, Communication channel
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94e4f18826426f907768f09f0f53b5ddTest
https://ieeexplore.ieee.org/document/8552391Test/