المؤلفون: May, D., Wunderle, B., Cirulis, I., Braun, S., Zschenderlein, U., Heilmann, J., Pantou, R., Schacht, R., Rzepka, R., Ras, M. Abo, Kurth, S., Kuhn, H.

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

الإتاحة: https://doi.org/10.1109/eurosime60745.2024.10491500Test
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491500.pdf?arnumber=10491500Test

المؤلفون: Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., Kuhn, H.

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

الإتاحة: https://doi.org/10.23919/empc55870.2023.10418420Test
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418420.pdf?arnumber=10418420Test

المؤلفون: Zschenderlein, U., Zhang, H., Ecke, Ramona, Jöhrmann, N., Wunderle, Bernhard

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2021; 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021; https://publica.fraunhofer.de/handle/publica/411675Test

الإتاحة: https://doi.org/10.1109/EuroSimE52062.2021.9410834Test
https://publica.fraunhofer.de/handle/publica/411675Test

المؤلفون: Wunderle, B., Meszmer, P., Mohnot, A., Tavakolibasti, M., Johrmann, N., Zschenderlein, U., Arnold, J., Voigt, S., Mehner, J., Ecke, R.

المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

الإتاحة: https://doi.org/10.1109/eurosime48426.2020.9152734Test
http://xplorestaging.ieee.org/ielx7/9146595/9152196/09152734.pdf?arnumber=9152734Test

المؤلفون: Zschenderlein, U., Klingler, M., Arnold, J., Baum, Mario, Weißbach, M., Schaal, M., Wunderle, Bernhard

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2019; 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019; https://publica.fraunhofer.de/handle/publica/406018Test

الإتاحة: https://doi.org/10.1109/EuroSimE.2019.8724559Test
https://publica.fraunhofer.de/handle/publica/406018Test

المؤلفون: Wunderle, B., May, D., Zschenderlein, U., Ecke, R., Springborn, M., Jöhrmann, N., Pareek, K.A., Heilmann, J., Stiebing, M., Arnold, J., Dudek, R., Schulz, S., Wolf, M.J., Rzepka, S.

الوقت: 621

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2018; 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018; https://publica.fraunhofer.de/handle/publica/403402Test

الإتاحة: https://doi.org/10.1109/EuroSimE.2018.8369901Test
https://publica.fraunhofer.de/handle/publica/403402Test

المؤلفون: Kumar, A., Zschenderlein, U., Baum, Mario, Brunschwiler, T., Wright, D.N., Wunderle, Bernhard

العلاقة: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2018; 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018; https://publica.fraunhofer.de/handle/publica/407372Test

الإتاحة: https://doi.org/10.1109/THERMINIC.2018.8593327Test
https://publica.fraunhofer.de/handle/publica/407372Test

المؤلفون: Stiebing, M., Vogel, D., Steller, W., Wolf, M.J., Zschenderlein, U., Wunderle, B.

الوقت: 621

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2017; 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; https://publica.fraunhofer.de/handle/publica/397547Test

الإتاحة: https://doi.org/10.1109/EuroSimE.2017.7926250Test
https://publica.fraunhofer.de/handle/publica/397547Test

المؤلفون: Zschenderlein, U., Baum, Mario, Schlottig, G., Schindler-Saefkow, Florian, Kumar, S.G., Wang, W.-S., Brunschwiler, T., Wunderle, Bernhard

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016; https://publica.fraunhofer.de/handle/publica/394316Test

الإتاحة: https://doi.org/10.1109/EuroSimE.2016.7463389Test
https://publica.fraunhofer.de/handle/publica/394316Test

المؤلفون: Brunschwiler, T., Zürcher, J., Zimmermann, Sven, Burg, B.R., Schlottig, G., Chen, X., Sinha, T., Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, A., Zschenderlein, U., Kumar, S., Wunderle, Bernhard, Haupt, M., Schindler-Saefkow, Florian, Strässle, R.

العلاقة: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016; 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings; https://publica.fraunhofer.de/handle/publica/395989Test

الإتاحة: https://doi.org/10.1109/ITHERM.2016.7517541Test
https://publica.fraunhofer.de/handle/publica/395989Test