المؤلفون: Yen, Yu-Wei, Hung, Fei-Yi, Zhao, Jun-Ren, Wu, Bo-Ding, Hsieh, Ho-Yen

المصدر: Journal of Alloys and Metallurgical Systems ; volume 6, page 100069 ; ISSN 2949-9178

الإتاحة: https://doi.org/10.1016/j.jalmes.2024.100069Test
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المؤلفون: Kuo, Yu-An, Hung, Fei-Yi, Zhao, Jun-Ren, Wu, Bo-Ding, Huang, Bo-Chin, Chang, Kai-Chieh, Chen, Kuan-Jen, Ku, Chen-Wang, Huang, Chih-Ying, Hsieh, Ho-Yen

المصدر: Journal of Alloys and Metallurgical Systems ; volume 3, page 100029 ; ISSN 2949-9178

الإتاحة: https://doi.org/10.1016/j.jalmes.2023.100029Test
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المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi, Chang, Kai-Chieh

المساهمون: National Cheng Kung University

المصدر: Materials Science and Engineering: B ; volume 303, page 117301 ; ISSN 0921-5107

مصطلحات موضوعية: Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science

الإتاحة: https://doi.org/10.1016/j.mseb.2024.117301Test
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المؤلفون: Chang, Yi-Tze, Hung, Fei-Yi, Wu, Bo-Ding

المصدر: Journal of Electronic Materials; Apr2024, Vol. 53 Issue 4, p1695-1707, 13p

مصطلحات موضوعية: COPPER wire, FATIGUE life, WIRE, HEAT treatment, COPPER, SURFACE temperature

المؤلفون: Hsu, Shen-Teng, Hung, Fei-Yi, Wu, Bo-Ding

المصدر: Journal of Materials Science: Materials in Electronics ; volume 34, issue 14 ; ISSN 0957-4522 1573-482X

مصطلحات موضوعية: Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1007/s10854-023-10572-xTest

المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi

المساهمون: Ministry of Science and Technology, Taiwan, National Cheng Kung University

المصدر: Materials Today Communications ; volume 36, page 106888 ; ISSN 2352-4928

مصطلحات موضوعية: Materials Chemistry, Mechanics of Materials, General Materials Science

الإتاحة: https://doi.org/10.1016/j.mtcomm.2023.106888Test
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المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi

المساهمون: National Cheng Kung University, Ministry of Science and Technology, Taiwan

المصدر: Microelectronics Reliability ; volume 139, page 114819 ; ISSN 0026-2714

مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1016/j.microrel.2022.114819Test
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المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi

المساهمون: National Cheng Kung University, Ministry of Science and Technology, Taiwan

المصدر: Microelectronics Reliability ; volume 124, page 114234 ; ISSN 0026-2714

مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1016/j.microrel.2021.114234Test
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المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi

الإتاحة: https://doi.org/10.2139/ssrn.4491668Test

المؤلفون: Wu, Bo-Ding, Hung, Fei-Yi

المصدر: Journal of Materials Science: Materials in Electronics; Jun2020, Vol. 31 Issue 12, p9270-9283, 14p

مصطلحات موضوعية: SEALING (Technology), WIRE, HEAT treatment, MICROSTRUCTURE, ALLOYS, THIN films