المؤلفون: Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong

المساهمون: School of Materials Science & Engineering

العلاقة: Journal of electronic materials; Kumar, A., Yang, Y., Wong, C. C., Kripesh, V., & Chen, Z. (2009). Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations. Journal of Electronic Materials, 38(1), 78-87.; https://hdl.handle.net/10356/97085Test; http://hdl.handle.net/10220/10436Test

الإتاحة: https://doi.org/10.1007/s11664-008-0565-6Test
https://hdl.handle.net/10356/97085Test
http://hdl.handle.net/10220/10436Test

المؤلفون: Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials

وصف الملف: 3 p.; application/pdf

العلاقة: Applied physics letters; Ang, X. F., Chen, Z., Wong, C. C., & Wei, J. (2008). Effect of Chain Length on Low Temperature Gold-Gold Bonding by Self Assembled Monolayers. Applied Physics Letters, 92(13).; https://hdl.handle.net/10356/85265Test; http://hdl.handle.net/10220/7703Test

الإتاحة: https://doi.org/10.1063/1.2906905Test
https://hdl.handle.net/10356/85265Test
http://hdl.handle.net/10220/7703Test

المؤلفون: Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials

وصف الملف: 7 p.; application/pdf

العلاقة: Journal of applied physics; Zhang, G. G., Ang, X. F., Chen, Z., & Wong, C. C. & Wei, J. (2007). Critical temperatures in thermocompression gold stud bonding. Journal of Applied Physics, 102 (6).; https://hdl.handle.net/10356/90506Test; http://hdl.handle.net/10220/7735Test

الإتاحة: https://doi.org/10.1063/1.2783974Test
https://hdl.handle.net/10356/90506Test
http://hdl.handle.net/10220/7735Test

المؤلفون: He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials

وصف الملف: 24 p.; application/pdf

العلاقة: Thin solid films; He, M., Chen, Z., Qi, G., Wong, C. C., & Mhaisalkar, S. G. (2004). Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization. Thin solid films, 462-463, 363-369.; https://hdl.handle.net/10356/79508Test; http://hdl.handle.net/10220/8155Test

الإتاحة: https://doi.org/10.1016/j.tsf.2004.05.045Test
https://hdl.handle.net/10356/79508Test
http://hdl.handle.net/10220/8155Test

المؤلفون: Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, Chee C., Wei, J.

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials

وصف الملف: 3 p.; application/pdf

العلاقة: Applied physics letters; Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, C. C. & Wei, J. (2007). Self-assembled monolayers for reduced temperature direct metal thermocompression bonding. Applied Physics Letters, 91(6).; https://hdl.handle.net/10356/90696Test; http://hdl.handle.net/10220/7708Test

الإتاحة: https://doi.org/10.1063/1.2768869Test
https://hdl.handle.net/10356/90696Test
http://hdl.handle.net/10220/7708Test

المؤلفون: Chen, Zhong, Xu, Xiaoda, Wong, Chee C., Mhaisalkar, Subodh Gautam

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials

وصف الملف: 26 p.; application/pdf

العلاقة: Surface and coatings technology; Chen, Z., Xu, X., Wong, C. C., & Mhaisalkar, S. G. (2003). Effect of plating parameters on the intrinsic stress in electroless nickel plating. Surface and coatings technology, 167(2-3), 170-176.; https://hdl.handle.net/10356/94041Test; http://hdl.handle.net/10220/8175Test

الإتاحة: https://doi.org/10.1016/S0257-8972Test(02)00911-8
https://hdl.handle.net/10356/94041Test
http://hdl.handle.net/10220/8175Test

المؤلفون: Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.

المساهمون: School of Mechanical and Aerospace Engineering

العلاقة: Journal of nanoscience and nanotechnology; Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, C. C., Mhaisalkar, S. G.,et al. (2008). Pulse electroplating of copper film : a study of process and microstructure. Journal of nanoscience and nanotechnology, 8 (5), 2568-2574; https://hdl.handle.net/10356/94840Test; http://hdl.handle.net/10220/8115Test

الإتاحة: https://doi.org/10.1166/jnn.2008.452Test
https://hdl.handle.net/10356/94840Test
http://hdl.handle.net/10220/8115Test

المؤلفون: Ang, Derrick, Wong, Chee C., Ramanujan, Raju V.

المساهمون: School of Materials Science & Engineering

مصطلحات موضوعية: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects

وصف الملف: 7 p.; application/pdf

العلاقة: Thin solid films; Ang, D., Wong, C. C., & Ramanujan, R. V. (2007). The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects. Thin Solid Films, 515, 3246-3252.; https://hdl.handle.net/10356/94246Test; http://hdl.handle.net/10220/7256Test; 143646

الإتاحة: https://doi.org/10.1016/j.tsf.2006.01.053Test
https://hdl.handle.net/10356/94246Test
http://hdl.handle.net/10220/7256Test

المؤلفون: Sharma, Vyom, Xia, Deying, Wong, Chee C., Carter, W. Craig, Chiang, Yet-Ming

المصدر: Journal of Materials Research ; volume 26, issue 2, page 247-253 ; ISSN 0884-2914 2044-5326

مصطلحات موضوعية: Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science

الإتاحة: https://doi.org/10.1557/jmr.2010.8Test
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S0884291410000087Test