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1مؤتمر
المؤلفون: Tzeng, J.J.-W., Weber, T.W., Krassowski, D.W.
المصدر: Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
الإتاحة: https://doi.org/10.1109/stherm.2000.837081Test
http://xplorestaging.ieee.org/ielx5/6765/18078/00837081.pdf?arnumber=837081Test -
2مؤتمر
المؤلفون: Norley, J., Tzeng, J.J.-W., Getz, G., Klug, J., Fedor, B.
المصدر: Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)
الإتاحة: https://doi.org/10.1109/stherm.2001.915157Test
http://xplorestaging.ieee.org/ielx5/7310/19764/00915157.pdf?arnumber=915157Test -
3مؤتمر
المؤلفون: Norley, J., Tzeng, J.J.-W., Getz, G., Klug, J., Fedor, B.
المصدر: Seventeenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.01CH37189); 2001, p107-110, 4p
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4مؤتمر
المؤلفون: Tzeng, J.J.-W., Weber, T.W., Krassowski, D.W.
المصدر: Sixteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.00CH37068); 2000, p174-181, 8p
