المؤلفون: Guvenir Torun S., Torun H. M., Hansen H. H. G., Gandini G., Berselli I., Codazzi V., de Korte C. L., van der Steen A. F. W., Migliavacca F., Chiastra C., Akyildiz A. C.

المساهمون: Guvenir Torun, S., Torun, H. M., Hansen, H. H. G., Gandini, G., Berselli, I., Codazzi, V., de Korte, C. L., van der Steen, A. F. W., Migliavacca, F., Chiastra, C., Akyildiz, A. C.

مصطلحات موضوعية: atherosclerosi, Bayesian optimization, coronary artery, finite element analysi, inflation test, material constant, ultrasound, Yeoh model

وصف الملف: ELETTRONICO

العلاقة: info:eu-repo/semantics/altIdentifier/wos/WOS:000697340000001; volume:12; firstpage:733009; numberofpages:12; journal:FRONTIERS IN PHYSIOLOGY; http://hdl.handle.net/11583/2950720Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85115375991; https://www.frontiersin.org/articles/10.3389/fphys.2021.733009/fullTest

الإتاحة: https://doi.org/10.3389/fphys.2021.733009Test
http://hdl.handle.net/11583/2950720Test

المؤلفون: Roy K., Dolatsara M. A., Torun H. M., Trinchero R., Swaminathan M.

المساهمون: Roy, K., Dolatsara, M. A., Torun, H. M., Trinchero, R., Swaminathan, M.

مصطلحات موضوعية: Coupled-training, Eye characteristic, High-speed link, Inverse design, Lifelong supervised learning

وصف الملف: ELETTRONICO

العلاقة: info:eu-repo/semantics/altIdentifier/isbn/978-1-7281-4585-3; info:eu-repo/semantics/altIdentifier/wos/WOS:000570016200015; ispartofbook:2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019; 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019; firstpage:1; lastpage:3; numberofpages:3; http://hdl.handle.net/11583/2836569Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85084536951

الإتاحة: https://doi.org/10.1109/EPEPS47316.2019.193220Test
http://hdl.handle.net/11583/2836569Test

المؤلفون: Trinchero R., Larbi M., Torun H. M., Canavero F. G., Swaminathan M.

المساهمون: Trinchero, R., Larbi, M., Torun, H. M., Canavero, F. G., Swaminathan, M.

مصطلحات موضوعية: integrated voltage regulator (IVR), LS-SVM regression, Machine learning, parameterized modeling, sparse PC expansion, surrogate model, SVM regression, uncertainty quantification, wireless power transfer (WPT)

وصف الملف: ELETTRONICO

العلاقة: info:eu-repo/semantics/altIdentifier/wos/WOS:000456190300001; volume:7; firstpage:4056; lastpage:4066; numberofpages:11; journal:IEEE ACCESS; http://hdl.handle.net/11583/2768139Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85059009798; http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6287639Test

الإتاحة: https://doi.org/10.1109/ACCESS.2018.2888903Test
http://hdl.handle.net/11583/2768139Test
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6287639Test

المؤلفون: Barbi, M., Torun, H. M., Swaminathan, M., Stievano, I. S., Canavero, F. G., Besnier, P.

المساهمون: Barbi, M., Torun, H. M., Swaminathan, M., Stievano, I. S., Canavero, F. G., Besnier, P.

مصطلحات موضوعية: 3D integration, Integrated voltage regulator, Magnetic core inductor, Polynomial chao, Uncertainty quantification, Signal Processing, Energy Engineering and Power Technology, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality

وصف الملف: STAMPA

العلاقة: info:eu-repo/semantics/altIdentifier/isbn/9781538622995; info:eu-repo/semantics/altIdentifier/wos/WOS:000587595100035; ispartofbook:2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings; 22nd IEEE Workshop on Signal and Power Integrity, SPI 2018; firstpage:1; lastpage:4; numberofpages:4; http://hdl.handle.net/11583/2712386Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85050460012; https://ieeexplore.ieee.org/document/8401677Test/

الإتاحة: https://doi.org/10.1109/SaPIW.2018.8401677Test
http://hdl.handle.net/11583/2712386Test
https://ieeexplore.ieee.org/document/8401677Test/

المؤلفون: Larbi, M., Torun, H. M., Swaminathan, M.

المصدر: 2019 IEEE MTT-S International Microwave Symposium (IMS)

الإتاحة: https://doi.org/10.1109/mwsym.2019.8700749Test
http://xplorestaging.ieee.org/ielx7/8697340/8700641/08700749.pdf?arnumber=8700749Test

المؤلفون: Lee, M., Kim, J., Singh, A., Torun, H. M., Swaminathan, M., Lim, S., Mukhopadhyay, S.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

الإتاحة: https://doi.org/10.1109/s3s.2018.8640215Test
http://xplorestaging.ieee.org/ielx7/8636845/8640128/08640215.pdf?arnumber=8640215Test

المؤلفون: Larbi, M., Torun, H. M., Swaminathan, M., Stievano, I. S., Canavero, F. G., Besnier, P.

المصدر: 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)

الإتاحة: https://doi.org/10.1109/sapiw.2018.8401677Test
http://xplorestaging.ieee.org/ielx7/8394764/8401641/08401677.pdf?arnumber=8401677Test