المؤلفون: Baishun Zhao, Fan Mo, Wangqing Wu, Bingyan Jiang, Gerhard Ziegmann

المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 3701-3709 (2023)

مصطلحات موضوعية: Microfluidic chips, Thermocompression bonding, Compression creep model, Microchannel deformation compensation, Cross-size microchannel coordination, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

العلاقة: http://www.sciencedirect.com/science/article/pii/S2238785423019543Test; https://doaj.org/toc/2238-7854Test

الوصول الحر: https://doaj.org/article/aca96ec56d984fc693e8fab6455fcf08Test

المؤلفون: Baishun Zhao, Wangqing Wu, Mingyong Zhou, Bingyan Jiang, Gerhard Ziegmann

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 639-652 (2023)

مصطلحات موضوعية: Microfluidic chips, In-mold thermocompression bonding, Bonding technology, Manufacturing of microfluidic chips, Micro-injection molding, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

العلاقة: http://www.sciencedirect.com/science/article/pii/S2238785423005021Test; https://doaj.org/toc/2238-7854Test

الوصول الحر: https://doaj.org/article/10a11c1c4d854b9786f3d0f144092b94Test

المؤلفون: Bargiel, Sylwester, Cogan, Julien, Queste, Samuel, Oliveri, Stefania, Gauthier-Manuel, Ludovic, Raschetti, Marina, Beurthey, Stephan, Perrin-Terrin, Mathieu

المساهمون: Franche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) (FEMTO-ST), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Centre National de la Recherche Scientifique (CNRS)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté COMUE (UBFC)-Université Bourgogne Franche-Comté COMUE (UBFC), Centre de Physique des Particules de Marseille (CPPM), Aix Marseille Université (AMU)-Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Centre National de la Recherche Scientifique (CNRS)

المصدر: ISSN: 2072-666X ; Micromachines ; https://hal.science/hal-04172809Test ; Micromachines, 2023, 14 (7), pp.1297. ⟨10.3390/mi14071297⟩.

مصطلحات موضوعية: microfluidic device, burst pressure test, bonding technology, anodic bonding, thermocompression bonding, microcooling, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.MAT]Engineering Sciences [physics]/Materials

العلاقة: hal-04172809; https://hal.science/hal-04172809Test; https://hal.science/hal-04172809/documentTest; https://hal.science/hal-04172809/file/e0663c38-dfcf-4f3d-9778-6ca890e3edb5-author.pdfTest; INSPIRE: 2686250

الإتاحة: https://doi.org/10.3390/mi14071297Test
https://hal.science/hal-04172809Test
https://hal.science/hal-04172809/documentTest
https://hal.science/hal-04172809/file/e0663c38-dfcf-4f3d-9778-6ca890e3edb5-author.pdfTest

المؤلفون: Sylwester Bargiel, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey, Mathieu Perrin-Terrin

المصدر: Micromachines; Volume 14; Issue 7; Pages: 1297

مصطلحات موضوعية: bonding technology, anodic bonding, thermocompression bonding, microcooling, microfluidic device, burst pressure test

وصف الملف: application/pdf

العلاقة: A：Physics; https://dx.doi.org/10.3390/mi14071297Test

الإتاحة: https://doi.org/10.3390/mi14071297Test

المؤلفون: Lykova, Maria, Panchenko, Juliana, Schneider-Ramelow, Martin, Suga, T., Mu, F., Buschbeck, R.

مصطلحات موضوعية: Cu-Cu bonding, SAM, SAM desorption, self-assembled monolayers, thermocompression bonding

العلاقة: Micromachines; #PLACEHOLDER_PARENT_METADATA_VALUE#; https://publica.fraunhofer.de/handle/publica/462416Test

الإتاحة: https://doi.org/10.3390/mi14071365Test
https://publica.fraunhofer.de/handle/publica/462416Test

المؤلفون: Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy Buschbeck

المصدر: Micromachines, Vol 14, Iss 7, p 1365 (2023)

مصطلحات موضوعية: Cu-Cu bonding, thermocompression bonding, self-assembled monolayers, SAM, SAM desorption, Mechanical engineering and machinery, TJ1-1570

العلاقة: https://www.mdpi.com/2072-666X/14/7/1365Test; https://doaj.org/toc/2072-666XTest; https://doaj.org/article/1003d249e5914bbe8877ab2a21af7e00Test

الإتاحة: https://doi.org/10.3390/mi14071365Test
https://doaj.org/article/1003d249e5914bbe8877ab2a21af7e00Test

المؤلفون: Kuchhangi, Ankit

مصطلحات موضوعية: Materials Science, Electrical engineering, III-V reconstitution, large diameter III-V wafer, thermocompression bonding

وصف الملف: application/pdf

الوصول الحر: https://escholarship.org/uc/item/0277d0xzTest

المؤلفون: Seok Jun Kang, Sung Hwa Bae, Injoon Son

المصدر: Archives of Metallurgy and Materials, Vol vol. 66, Iss No 4, Pp 963-966 (2021)

مصطلحات موضوعية: tin electroplating, thermoelectric module, thermocompression bonding, bi2te3, direct bonding, Mining engineering. Metallurgy, TN1-997, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

العلاقة: https://journals.pan.pl/Content/119279/PDF/AMM-2021-4-08-Injoon%20Son.pdfTest; https://doaj.org/toc/2300-1909Test

الوصول الحر: https://doaj.org/article/fcc2cd81e1014c4fabdc2f782b0d810dTest

المؤلفون: Bergmann, Michael Alexander, 1989

مصطلحات موضوعية: thin-film flip-chip, light-emitting diodes, UVB, AlGaN, thermocompression bonding, substrate removal, ultraviolet light, electrochemical etching, heterogeneous integration, LEDs

وصف الملف: electronic

الوصول الحر: https://research.chalmers.se/publication/518797Test
https://research.chalmers.se/publication/518797/file/518797_Fulltext.pdfTest

المؤلفون: Buschbeck, Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy

المصدر: Micromachines; Volume 14; Issue 7; Pages: 1365

مصطلحات موضوعية: Cu-Cu bonding, thermocompression bonding, self-assembled monolayers, SAM, SAM desorption

وصف الملف: application/pdf

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=multidiscipl::419e9b578a1d0990b693d357565c9e8fTest