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1مؤتمر
المؤلفون: 山田 智明, T. Yamada, D. Ito, T. Sluka, 坂田 修身, O. Sakata, 舟窪 浩, H. Funakubo, T. Namazu, M. Yoshino, N. Setter, T. Nagasaki
العلاقة: http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100804100Test; oai:t2r2.star.titech.ac.jp:50488199
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2مؤتمر
المؤلفون: 山田 智明, Tomoaki Yamada, D. Ito, T. Sluka, N. Setter, 坂田 修身, O. Sakata, T. Namazu, 舟窪 浩, H. Funakubo, M. Yoshino, T. Nagasaki
العلاقة: http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100771519Test; oai:t2r2.star.titech.ac.jp:50423322
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3مؤتمر
المؤلفون: T. Yamada, D. Ito, T. Sluka, N. Setter, 坂田 修身, O. Sakata, T. Namazu, 舟窪 浩, H. Funakubo, M. Yoshino, T. Nagasaki
العلاقة: http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100748210Test; oai:t2r2.star.titech.ac.jp:50380170
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4
المؤلفون: Shozo Inoue, T. Namazu, K. Ootani, Y. Yamano
المصدر: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
مصطلحات موضوعية: Exothermic reaction, Fracture toughness, Materials science, Flexural strength, Soldering, Metallurgy, Wafer, Wafer dicing, Bending, Adhesive, Composite material
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::32c7af6e15c09cfb7392359a4764452aTest
https://doi.org/10.1109/sensor.2009.5285537Test -
5
المصدر: The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE.
مصطلحات موضوعية: Microelectromechanical systems, Nanoelectromechanical systems, Materials science, Silicon, Silicon dioxide, Nanowire, chemistry.chemical_element, Nanotechnology, Bending, chemistry.chemical_compound, chemistry, Nano, Composite material, Nanoscopic scale
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::ed2106abae96af45c64e12ddbf89ec2fTest
https://doi.org/10.1109/memsys.2003.1189836Test -
6
المصدر: Proceedings of the 2nd IEEE Conference on Nanotechnology.
مصطلحات موضوعية: Thermal oxidation, symbols.namesake, Materials science, Brittleness, Stress–strain curve, Nanowire, symbols, Modulus, Young's modulus, Fracture mechanics, Bending, Composite material
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::f7245d0a047094cd0c7fc2cc7825083bTest
https://doi.org/10.1109/nano.2002.1032122Test -
7مؤتمر
المؤلفون: T. Namazu, H. Takemoto, H. Fujita, Y. Nagai, S. Inoue
المصدر: 19th IEEE International Conference on Micro Electro Mechanical Systems; 2006, p286-289, 4p