المؤلفون: K Nieman, Andrew D. Oliver, T A Wallner, Paul L. Bergstrom, R Tandon

المصدر: Journal of Micromechanics and Microengineering. 18:075026

مصطلحات موضوعية: Microelectromechanical systems, Engineering drawing, Materials science, Silicon, Mechanical Engineering, chemistry.chemical_element, Diamond, engineering.material, Die (integrated circuit), Electronic, Optical and Magnetic Materials, Stress (mechanics), chemistry, Mechanics of Materials, engineering, Fracture (geology), Wafer, Electrical and Electronic Engineering, Composite material, Actuator

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::16784ba5b339fe16a6b315487da156f2Test
https://doi.org/10.1088/0960-1317/18/7/075026Test

المؤلفون: A D Oliver, T A Wallner, R Tandon, K Nieman, P L Bergstrom

المصدر: Journal of Micromechanics & Microengineering. Jul2008, Vol. 18 Issue 7, p75026-75026. 1p.

مصطلحات موضوعية: *SEMICONDUCTOR wafers, *MEDIAN (Mathematics), *STATISTICS, *STANDARD deviations