-
1
المؤلفون: Anuradha M. Agarwal, Drew Weninger, Lionel C. Kimerling, Guiru Gu, Cheryl Schnitzer, Karl Kissa, Edward Deveney, Samuel Serna, Elif Demirbas, Douglas Petkie, James Eakin, Jacob Longacre, Adrienne Linnell, Kathy Rentsch, Farhad Vazehgoo, Stephen Adamshick, Nicholas M. Massa, Andrea Agliati
المصدر: Optics Education and Outreach VII.
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::4d4f032c1de63c285569f442f1688453Test
https://doi.org/10.1117/12.2633227Test -
2
المصدر: MWSCAS
مصطلحات موضوعية: Phased array, Computer science, 020208 electrical & electronic engineering, 020206 networking & telecommunications, 02 engineering and technology, Chip, Microstrip, Antenna array, System in package, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Baseband, Return loss, Electronic engineering, Insertion loss, RFIC, Antenna (radio)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::435bc768744627cd4d803eab3f2c103eTest
https://doi.org/10.1109/mwscas48704.2020.9184617Test -
3
المؤلفون: T. Searles, Stephen Adamshick, John Burke, M. Musiak, Alexander D. Johnson
المصدر: 2019 IEEE International Flexible Electronics Technology Conference (IFETC).
مصطلحات موضوعية: Patch antenna, Beamwidth, Materials science, business.industry, Return loss, Optoelectronics, Substrate (printing), Antenna (radio), business, Microstrip, Radiation pattern, Antenna efficiency
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::97ba098a80a9dd989d1d1728c9eafc11Test
https://doi.org/10.1109/ifetc46817.2019.9073767Test -
4
المؤلفون: Stephen Adamshick, Michael Liehr, Steven Northrup
المصدر: Micro & Nano Letters. 13:1457-1459
مصطلحات موضوعية: Materials science, Biomedical Engineering, Bioengineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit, Integrated circuit design, 01 natural sciences, Die (integrated circuit), law.invention, Footprint (electronics), System in package, law, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, General Materials Science, 010302 applied physics, Interconnection, business.industry, 020208 electrical & electronic engineering, Transistor, Condensed Matter Physics, Optoelectronics, Coaxial, business
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::5ae1d200df1a546d0b46254ede61936dTest
https://doi.org/10.1049/mnl.2018.5280Test -
5
المؤلفون: Stephen Adamshick, John Burke, Michael Liehr
المصدر: Micro & Nano Letters. 12:301-303
مصطلحات موضوعية: Fabrication, Materials science, Diffusion barrier, Biomedical Engineering, Copper interconnect, chemistry.chemical_element, Bioengineering, 02 engineering and technology, 01 natural sciences, law.invention, chemistry.chemical_compound, Tantalum nitride, law, Chemical-mechanical planarization, 0103 physical sciences, Shielded cable, General Materials Science, Electrical measurements, 010302 applied physics, business.industry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Copper, chemistry, Optoelectronics, 0210 nano-technology, business
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::35daac6346c5d216db533483760b819bTest
https://doi.org/10.1049/mnl.2016.0462Test -
6
المؤلفون: K. Moriarty, John Burke, W. Tremblay, Stephen Adamshick, Alexander D. Johnson
المصدر: MWSCAS
مصطلحات موضوعية: Engineering, Coaxial antenna, business.industry, 020208 electrical & electronic engineering, Antenna measurement, 020206 networking & telecommunications, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Periscope antenna, law.invention, Passive radiator, Hardware_GENERAL, law, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Feed line, Dipole antenna, Antenna (radio), business, Monopole antenna
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::09e26bec5cba14180a66d545cae31977Test
https://doi.org/10.1109/mwscas.2017.8052897Test -
7
المؤلفون: Stephen Adamshick, Douglas D. Coolbaugh, Michael Liehr
المصدر: Microelectronics Journal. 46:377-382
مصطلحات موضوعية: Interconnection, Materials science, Through-silicon via, business.industry, Attenuation, General Engineering, Capacitance, Signal, Inductance, Extremely high frequency, Electronic engineering, Optoelectronics, Coaxial, business
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::88d059cf642f27c9c49f891e36aa887cTest
https://doi.org/10.1016/j.mejo.2015.02.011Test -
8
المؤلفون: Stephen Adamshick, Douglas D. Coolbaugh, Michael Liehr
المصدر: Electronics Letters. 49:1028-1030
مصطلحات موضوعية: Engineering, Three dimensional integration, Fabrication, Through-silicon via, Silicon, business.industry, chemistry.chemical_element, CMOS, chemistry, Electronic engineering, Electrical and Electronic Engineering, Coaxial, business, Cmos process
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::3416cdd5b5e1db072b6dbb145209624bTest
https://doi.org/10.1049/el.2013.1165Test -
9
المؤلفون: James R. Lloyd, Charles Settens, C. Durcan, Stephen Adamshick, Zhenjun Zhang, B. T. McGowan, I. N. Lund, Y. Kandel
المصدر: 2012 IEEE International Integrated Reliability Workshop Final Report.
مصطلحات موضوعية: Mass transport, Materials science, Condensed matter physics, food and beverages, chemistry.chemical_element, Copper, Conductor, Metal, chemistry, Dimension (vector space), visual_art, visual_art.visual_art_medium, Grain boundary, Diffusion (business)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::6426bfc6e104d321a121d5aae304cb45Test
https://doi.org/10.1109/iirw.2012.6468943Test