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1دورية أكاديمية
المؤلفون: Bosch, Carles, Lindenau, Joerg, Pacureanu, Alexandra, Peddie, Christopher J, Majkut, Marta, Douglas, Andrew C, Carzaniga, Raffaella, Rack, Alexander, Collinson, Lucy, Schaefer, Andreas T, Stegmann, Heiko
المصدر: Applied Physics Letters , 122 (14) , Article 143701. (2023)
وصف الملف: text
العلاقة: https://discovery.ucl.ac.uk/id/eprint/10168271/1/5.0142405%20%281%29.pdfTest; https://discovery.ucl.ac.uk/id/eprint/10168271Test/
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2مؤتمر
المصدر: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
الإتاحة: https://doi.org/10.1109/asmc61125.2024.10545513Test
http://xplorestaging.ieee.org/ielx8/10545359/10545360/10545513.pdf?arnumber=10545513Test -
3مؤتمر
المؤلفون: Huang, Chengliang, Viswanathan, Vignesh, Rummel, Andreas, Johnson, Greg M., Stegmann, Heiko, Andrew, Elliott, Gu, Allen, Terada, Masako, Rodgers, Thomas
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
الإتاحة: https://doi.org/10.23919/empc55870.2023.10418290Test
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418290.pdf?arnumber=10418290Test -
4مؤتمر
المؤلفون: Johnson, Greg M., Rummel, Andreas, Stegmann, Heiko, Huang, Chengliang
المصدر: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
الإتاحة: https://doi.org/10.1109/asmc57536.2023.10121104Test
http://xplorestaging.ieee.org/ielx7/10121052/10121025/10121104.pdf?arnumber=10121104Test -
5مؤتمر
المؤلفون: Johnson, Greg M., Rummel, Andreas, Stegmann, Heiko
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
الإتاحة: https://doi.org/10.1109/ipfa58228.2023.10249048Test
http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249048.pdf?arnumber=10249048Test -
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7مؤتمر
المؤلفون: Gu, Allen, Terada, Masako, Stegmann, Heiko, Rodgers, Thomas, Fu, Chao, Yang, Yanjing
المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
الإتاحة: https://doi.org/10.1109/ipfa55383.2022.9915756Test
http://xplorestaging.ieee.org/ielx7/9915553/9915704/09915756.pdf?arnumber=9915756Test -
8مؤتمر
المؤلفون: Johnson, Greg, Rodgers, Thomas, Stegmann, Heiko, Hitzel, Frank
المصدر: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
الإتاحة: https://doi.org/10.1109/asmc54647.2022.9792505Test
http://xplorestaging.ieee.org/ielx7/9792471/9792473/09792505.pdf?arnumber=9792505Test -
9دورية أكاديمية
المؤلفون: Serrano-Zabaleta, S., Larrea, A., Stegmann, Heiko, Waltenberg, Carsten
المساهمون: Universidad de Zaragoza
العلاقة: Postprint; Sí; Microscopy and Analysis 27(6): 23-26 (2013); http://hdl.handle.net/10261/117563Test; http://dx.doi.org/10.13039/501100007041Test
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