دورية أكاديمية

50 nm Pattern Etching of Si Wafer by Synchrotron Radiation Excited CF 4 Plasma

التفاصيل البيبلوغرافية
العنوان: 50 nm Pattern Etching of Si Wafer by Synchrotron Radiation Excited CF 4 Plasma
المؤلفون: Ryoichi Inanami, Ryoichi Inanami, Tomoya Yamada, Tomoya Yamada, Shintaro Ohsaki, Shintaro Ohsaki, Shinji Ogawa, Shinji Ogawa, Shinzo Morita, Shinzo Morita
المصدر: Japanese Journal of Applied Physics ; volume 36, issue 12S, page 7706 ; ISSN 0021-4922 1347-4065
بيانات النشر: IOP Publishing
سنة النشر: 1997
الوصف: 50 nm lines and spaces pattern etching on a Si wafer in a synchrotron radiation (SR) excited CF 4 gas atmosphere was performed under a negative bias voltage in which the SR light beam was irradiated perpendicularly to the Si wafer. As etching species, positive ions are expected to be predominant. The SR excited plasma and the excited species are discussed.
نوع الوثيقة: article in journal/newspaper
اللغة: unknown
DOI: 10.1143/jjap.36.7706
DOI: 10.1143/JJAP.36.7706
DOI: 10.1143/JJAP.36.7706/pdf
الإتاحة: https://doi.org/10.1143/jjap.36.7706Test
حقوق: https://iopscience.iop.org/page/copyrightTest ; https://iopscience.iop.org/info/page/text-and-data-miningTest
رقم الانضمام: edsbas.98D973F5
قاعدة البيانات: BASE