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1تقرير
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2دورية أكاديمية
المؤلفون: Chin, Wei Chun, Pashkovich, Andrei, Schutt-Aine, Jose E., Ahmad, Nur Syazreen, Goh, Patrick
المساهمون: Ministry of Higher Education, Malaysia, through the Fundamental Research Grant Scheme, U.S. Army Small Business Innovation Research (SBIR) Program Office, U.S. Army Research Office, Silvaco, Inc.
المصدر: IEEE Access ; volume 9, page 159334-159348 ; ISSN 2169-3536
مصطلحات موضوعية: General Engineering, General Materials Science, General Computer Science
الإتاحة: https://doi.org/10.1109/access.2021.3131730Test
https://ieeexplore.ieee.org/ielam/6287639/9312710/9631234-aam.pdfTest
http://xplorestaging.ieee.org/ielx7/6287639/9312710/09631234.pdf?arnumber=9631234Test -
3مؤتمر
المؤلفون: Shi, Bobi, Schutt-Aine, Jose E.
المساهمون: Army Research Office, Zhejiang University
المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
الإتاحة: https://doi.org/10.1109/edaps58880.2023.10468527Test
http://xplorestaging.ieee.org/ielx7/10467193/10468066/10468527.pdf?arnumber=10468527Test -
4مؤتمر
المؤلفون: Zhou, Yi, Shi, Bobi, Schutt-Ainé, José E.
المصدر: 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)
الإتاحة: https://doi.org/10.1109/spi57109.2023.10145539Test
http://xplorestaging.ieee.org/ielx7/10145490/10145514/10145539.pdf?arnumber=10145539Test -
5دورية أكاديمية
المؤلفون: Zhao, Yixuan, Nguyen, Thong, Ma, Hanzhi, Li, Er-Ping, Cangellaris, Andreas C., Schutt-Ainé, José E.
المساهمون: U.S. Army Small Business Innovation Research (SBIR) Program Office, U.S. Army Research Office
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 13, issue 10, page 1603-1612 ; ISSN 2156-3950 2156-3985
مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
الإتاحة: https://doi.org/10.1109/tcpmt.2023.3299248Test
https://ieeexplore.ieee.org/ielam/5503870/10288291/10196036-aam.pdfTest
http://xplorestaging.ieee.org/ielx7/5503870/10288291/10196036.pdf?arnumber=10196036Test -
6دورية أكاديمية
المؤلفون: Wang, Da-Wei, Chen, Wenchao, Zhao, Wen-Sheng, Zhu, Guo-Dong, Kang, Kai, Gao, Pingqi, Schutt-Aine, Jose E., Yin, Wen-Yan
المساهمون: National Natural Science Foundation of China, Science Challenge Project, Talent Project of Zhejiang Association for Science and Technology, Zhejiang University, University of Illinois
المصدر: IEEE Access ; volume 7, page 3897-3908 ; ISSN 2169-3536
مصطلحات موضوعية: General Engineering, General Materials Science, General Computer Science, Electrical and Electronic Engineering
الإتاحة: https://doi.org/10.1109/access.2018.2888572Test
http://xplorestaging.ieee.org/ielx7/6287639/8600701/08580571.pdf?arnumber=8580571Test -
7دورية أكاديمية
المؤلفون: Wang, Da-Wei, Chen, Wenchao, Zhao, Wen-Sheng, Zhu, Guo-Dong, Zhao, Zhen-Guo, Schutt-Aine, Jose E., Yin, Wen-Yan
المساهمون: National Natural Science Foundation of China, Science Challenge Project, Talent Project of the Zhejiang Association for Science and Technology, Zhejiang University, University of Illinois
المصدر: IEEE Access ; volume 7, page 31273-31285 ; ISSN 2169-3536
مصطلحات موضوعية: General Engineering, General Materials Science, General Computer Science
الإتاحة: https://doi.org/10.1109/access.2019.2902406Test
http://xplorestaging.ieee.org/ielx7/6287639/8600701/08656503.pdf?arnumber=8656503Test -
8مؤتمر
المؤلفون: Zhou, Yi, Shi, Bobi, Zhao, Yixuan, Schutt-Aine, Jose E.
المصدر: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
الإتاحة: https://doi.org/10.1109/edaps56906.2022.9995484Test
http://xplorestaging.ieee.org/ielx7/9994795/9994852/09995484.pdf?arnumber=9995484Test -
9مؤتمر
المؤلفون: Zhao, Yixuan, Nguyen, Thong, Ma, Hanzhi, Li, Er-Ping, Cangellaris, Andreas, Schutt-Aine, Jose E.
المصدر: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
الإتاحة: https://doi.org/10.1109/edaps56906.2022.9995074Test
http://xplorestaging.ieee.org/ielx7/9994795/9994852/09995074.pdf?arnumber=9995074Test -
10مؤتمر
المؤلفون: Zhao, Yixuan, Nguyen, Thong, Schutt-Aine, Jose E.
المصدر: 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)
الإتاحة: https://doi.org/10.1109/spi54345.2022.9874932Test
http://xplorestaging.ieee.org/ielx7/9874829/9874923/09874932.pdf?arnumber=9874932Test