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1تقرير
المؤلفون: Wolf, Jürgen, Ramm, P., Klumpp, Armin, Reichl, H.
المصدر: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
مصطلحات موضوعية: Computer Science - Other Computer Science
الوصول الحر: http://arxiv.org/abs/0805.0917Test
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2تقرير
المؤلفون: Jung, E., Manessis, D., Neumann, A., Bottcher, L., Braun, T., Bauer, J., Reichl, H., Iafelice, B., Destro, F., Gambari, R.
المصدر: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
مصطلحات موضوعية: Computer Science - Other Computer Science
الوصول الحر: http://arxiv.org/abs/0802.3082Test
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3تقرير
المؤلفون: Schacht, R., May, D., Wunderle, B., Wittler, O., Gollhardt, A., Michel, B., Reichl, H.
المصدر: Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
مصطلحات موضوعية: Condensed Matter - Materials Science
الوصول الحر: http://arxiv.org/abs/0709.1849Test
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4مؤتمر
المؤلفون: Le, T.H., Rossi, M., Ndip, I., Kaiser, M., Manier, C.-A., Gernhardt, R., Oppermann, H., Lang, K.-D., Reichl, H.
الوقت: 621
العلاقة: European Conference on Antennas and Propagation (EuCAP) 2021; 15th European Conference on Antennas and Propagation, EuCAP 2021; https://publica.fraunhofer.de/handle/publica/411785Test
الإتاحة: https://doi.org/10.23919/EuCAP51087.2021.9411051Test
https://publica.fraunhofer.de/handle/publica/411785Test -
5دورية أكاديمية
المؤلفون: Hahn, R., Glaw, V., Ginolas, A., Töpfer, M., Wittke, K., Reichl, H.
المصدر: Microelectronics International: An International Journal, 1999, Vol. 16, Issue 1, pp. 21-26.
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6مؤتمر
المؤلفون: Jung, E., Manessis, D., Neumann, A., Bottcher, L., Braun, T., Bauer, J., Reichl, H., Iafelice, B., Destro, F., Gambari, R.
المساهمون: Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Fraunhofer (Fraunhofer-Gesellschaft), Alma Mater Studiorum Università di Bologna Bologna (UNIBO), Università degli Studi di Ferrara (UniFE)
المصدر: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; DTIP 2007 ; https://hal.archives-ouvertes.fr/hal-00257685Test ; DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.184-186
مصطلحات موضوعية: Manufacturing Techniques, [INFO.INFO-OH]Computer Science [cs]/Other [cs.OH], [INFO.INFO-AR]Computer Science [cs]/Hardware Architecture [cs.AR]
جغرافية الموضوع: Stresa, lago Maggiore, Italy
العلاقة: info:eu-repo/semantics/altIdentifier/arxiv/0802.3082; hal-00257685; https://hal.archives-ouvertes.fr/hal-00257685Test; https://hal.archives-ouvertes.fr/hal-00257685/documentTest; https://hal.archives-ouvertes.fr/hal-00257685/file/dtip07_1066.pdfTest; ARXIV: 0802.3082
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7مؤتمر
المؤلفون: May, D., Wunderle, B., Schindler-Saefkow, F., Nguyen, B., Schacht, R., Michel, B., Reichl, H.
المساهمون: Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Fraunhofer (Fraunhofer-Gesellschaft), Technische Universität Berlin (TU)
المصدر: 13th International Worshop on THERMal INvestigations of ICs and Systems
THERMINIC 2007
https://hal.archives-ouvertes.fr/hal-00202552Test
THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.150-155مصطلحات موضوعية: Cooling concept, liquid cooling, CFD analysis, liquid pump, [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci]
العلاقة: hal-00202552; https://hal.archives-ouvertes.fr/hal-00202552Test; https://hal.archives-ouvertes.fr/hal-00202552/documentTest; https://hal.archives-ouvertes.fr/hal-00202552/file/therm07150.pdfTest
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8مؤتمر
المؤلفون: Wunderle, B., Braun, T., May, D., Mazloum, A., Bouazza, M., Walter, H., Wittler, O., Schacht, R., Becker, K.-F., Schneider-Ramelow, M., Michel, B., Reichl, H.
المساهمون: Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Fraunhofer (Fraunhofer-Gesellschaft), Forschungsschwerpunkt Technologien der Mikroperipherik, Technische Universität Berlin (TU)
المصدر: 13th International Worshop on THERMal INvestigations of ICs and Systems
THERMINIC 2007
https://hal.archives-ouvertes.fr/hal-00202543Test
THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.104-109مصطلحات موضوعية: Integrated Passives Chip Ceramic Capacitors Reliability and Lifetime prediction Thermo-mechanical loading Failure analysis and models Heterogeneous Integration, [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci]
العلاقة: hal-00202543; https://hal.archives-ouvertes.fr/hal-00202543Test; https://hal.archives-ouvertes.fr/hal-00202543/documentTest; https://hal.archives-ouvertes.fr/hal-00202543/file/therm07104.pdfTest
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9دورية أكاديمية
المؤلفون: Aschenbrenner, R., Zakel, E., Azdasht**, G., Kloeser, A., Reichl, H.
المصدر: Soldering & Surface Mount Technology, 1996, Vol. 8, Issue 2, pp. 5-11.
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10دورية أكاديمية
المؤلفون: Azdasht, G., Zakel, E., Reichl, H.
المصدر: Soldering & Surface Mount Technology, 1996, Vol. 8, Issue 1, pp. 51-54.
النص الكامل