المؤلفون: May, D., Wunderle, B., Cirulis, I., Braun, S., Zschenderlein, U., Heilmann, J., Pantou, R., Schacht, R., Rzepka, R., Ras, M. Abo, Kurth, S., Kuhn, H.

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

الإتاحة: https://doi.org/10.1109/eurosime60745.2024.10491500Test
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491500.pdf?arnumber=10491500Test

المؤلفون: Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., Kuhn, H.

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

الإتاحة: https://doi.org/10.23919/empc55870.2023.10418420Test
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418420.pdf?arnumber=10418420Test

المؤلفون: Pantou, R., Hildebrandt, M., Dudek, R., Rzepka, S.

العلاقة: MikroSystemTechnik Kongress 2019; https://publica.fraunhofer.de/handle/publica/410764Test

الإتاحة: https://publica.fraunhofer.de/handle/publica/410764Test

المؤلفون: Schindler-Saefkow, F., Pantou, R., Keller, J., Rzepka, S.

العلاقة: International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017; Smart Systems Integration 2017; https://publica.fraunhofer.de/handle/publica/399344Test

الإتاحة: https://publica.fraunhofer.de/handle/publica/399344Test

المؤلفون: Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.

المصدر: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

الإتاحة: https://doi.org/10.1109/eurosime.2015.7103126Test
http://xplorestaging.ieee.org/ielx7/7095627/7103074/07103126.pdf?arnumber=7103126Test

المؤلفون: Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, K. M. B., Pantou, R., Weiss, L., Michel, B., Wunderle, B.

المصدر: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)

الإتاحة: https://doi.org/10.1109/estc.2014.6962781Test
http://xplorestaging.ieee.org/ielx7/6943419/6962707/06962781.pdf?arnumber=6962781Test

المؤلفون: Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, K.M.B., Pantou, R., Michel, B., Wunderle, B.

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

الإتاحة: https://doi.org/10.1109/eurosime.2014.6813833Test
http://xplorestaging.ieee.org/ielx7/6808929/6813763/06813833.pdf?arnumber=6813833Test

المؤلفون: Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mroßko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.

العلاقة: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2013; 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013; https://publica.fraunhofer.de/handle/publica/381494Test

الإتاحة: https://doi.org/10.1109/EuroSimE.2013.6529941Test
https://publica.fraunhofer.de/handle/publica/381494Test

المؤلفون: Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mroßko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.

المصدر: Microelectronics Reliability ; volume 54, issue 6-7, page 1243-1252 ; ISSN 0026-2714

مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1016/j.microrel.2014.02.022Test
https://api.elsevier.com/content/article/PII:S002627141400078X?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S002627141400078X?httpAccept=text/plainTest

المؤلفون: Todt, U., Hild, O., Toerker, M., Schreil, M., Eritt, M., Löffler, F., May, C., Luber, C., Morgan, B., Pantou, R., Brückner, J., Hill, D., Bunk, G., Vogel, U., Amelung, J., Leo, K.

مصطلحات موضوعية: OFET/OLED-technology

الوقت: 621

العلاقة: Internationales Symposium Technologies for Polymer Electronics (TPE) 2004; Internationales Symposium Technologies for Polymer Electronics, TPE 2004; https://publica.fraunhofer.de/handle/publica/345682Test

الإتاحة: https://publica.fraunhofer.de/handle/publica/345682Test