المؤلفون: Norley, J.

مصطلحات موضوعية: 669

الإتاحة: https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.691833Test

المؤلفون: Shooshtari, A., Kahn, J., Bar-Cohen, A., Dessiatoun, S., Ohadi, M., Getz, M., Norley, J.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

الإتاحة: https://doi.org/10.1109/itherm.2006.1645370Test
http://xplorestaging.ieee.org/ielx5/10950/34484/01645370.pdf?arnumber=1645370Test

المؤلفون: Shives, G., Norley, J., Smalc, M., Chen, G., Capp, J.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

الإتاحة: https://doi.org/10.1109/itherm.2004.1319204Test
http://xplorestaging.ieee.org/ielx5/9211/29232/01319204.pdf?arnumber=1319204Test

المؤلفون: Norley, J., Tzeng, J.J.-W., Getz, G., Klug, J., Fedor, B.

المصدر: Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)

الإتاحة: https://doi.org/10.1109/stherm.2001.915157Test
http://xplorestaging.ieee.org/ielx5/7310/19764/00915157.pdf?arnumber=915157Test

المؤلفون: Marotta, E.E., Mazzuca, S.J., Norley, J.

المصدر: IEEE Transactions on Components and Packaging Technologies ; volume 28, issue 1, page 102-110 ; ISSN 1521-3331

مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1109/tcapt.2004.843153Test
http://xplorestaging.ieee.org/ielx5/6144/30452/01402619.pdf?arnumber=1402619Test

المؤلفون: Petroski, J., Norley, J., Schober, J., Reis, B., Reynolds, R.A.

المصدر: 2010 12th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2010, p1-10, 10p

المؤلفون: Yin Xiong, Smalc, M., Norley, J., Chang, J., Mayer, H.

المصدر: 2008 11th Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems; 2008, p583-590, 8p

المؤلفون: Skandakumaran, P., Khanikar, V., Smalc, M., Norley, J., Reis, B.

المصدر: 2008 11th Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems; 2008, p26-30, 5p

المؤلفون: Norley, J., Tzeng, J.J.-W., Getz, G., Klug, J., Fedor, B.

المصدر: Seventeenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.01CH37189); 2001, p107-110, 4p

المؤلفون: Sheppard, T., Norley, J.

المصدر: Materials Science & Technology; October 1988, Vol. 4 Issue: 10 p903-908, 6p