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1مؤتمر
المؤلفون: Krishnan, S., Kwon, U., Moumen, N., Stoker, M.W., Harley, E.C.T., Bedell, S., Nair, D., Greene, B., Henson, W., Chowdhury, M., Prakash, D.P., Wu, E., Ioannou, D., Cartier, E., Na, M.-H., Inumiya, S., Mcstay, K., Edge, L., Iijima, R., Cai, J., Frank, M., Hargrove, M., Guo, D., Kerber, A., Jagannathan, H., Ando, T., Shepard, J., Siddiqui, S., Dai, M., Bu, H., Schaeffer, J., Jaeger, D., Barla, K., Wallner, T., Uchimura, S., Lee, Y., Karve, G., Zafar, S., Schepis, D., Wang, Y., Donaton, R., Saroop, S., Montanini, P., Liang, Y., Stathis, J., Carter, R., Pal, R., Paruchuri, V., Yamasaki, H., Lee, J-H.
المصدر: 2011 International Electron Devices Meeting
الإتاحة: https://doi.org/10.1109/iedm.2011.6131628Test
http://xplorestaging.ieee.org/ielx5/6123666/6131464/06131628.pdf?arnumber=6131628Test -
2مؤتمر
المؤلفون: Na, M. H., Mcstay, K., Nowak, E. J.
المصدر: 68th Device Research Conference
الإتاحة: https://doi.org/10.1109/drc.2010.5551912Test
http://xplorestaging.ieee.org/ielx5/5543947/5551849/05551912.pdf?arnumber=5551912Test -
3مؤتمر
المؤلفون: Goyal, P., Gupta, S., Krishnan, R., Davies, W., Ho, H., Tessier, A., Arya, A., Deshpande, S., Fang, S., Lee, S., Li, Z., Liu, J., Takalkar, R., Dadson, J., Chakravarti, A., Domenicucci, A., Shepard, J., McStay, K., Morgenfeld, B., Allen, S., Li, X., Khan, B., Knarr, R., Arndt, R., Venigalla, R., Parries, P., Chudzik, M., Stiffler, S.
المصدر: 2010 IEEE International SOI Conference (SOI)
الإتاحة: https://doi.org/10.1109/soi.2010.5641378Test
http://xplorestaging.ieee.org/ielx5/5629482/5641025/05641378.pdf?arnumber=5641378Test -
4مؤتمر
المؤلفون: Wang, G., Anand, D., Butt, N., Cestero, A., Chudzik, M., Ervin, J., Fang, S., Freeman, G., Ho, H., Khan, B., Kim, B., Kong, W., Krishnan, R., Krishnan, S., Kwon, O., Liu, J., McStay, K., Nelson, E., Nummy, K., Parries, P., Sim, J., Takalkar, R., Tessier, A., Todi, R.M., Malik, R., Stiffler, S., Iyer, S.S.
المصدر: 2009 IEEE International Electron Devices Meeting (IEDM)
الإتاحة: https://doi.org/10.1109/iedm.2009.5424375Test
http://xplorestaging.ieee.org/ielx5/5419306/5424206/05424375.pdf?arnumber=5424375Test -
5مؤتمر
المؤلفون: Logan, L. R., Greene, B. J., McStay, K., Liang, Q., Na, M -H., Nowak, E., Ku, S. -H., Friedrich, J., Clougherty, F., Dufrene, B., Zamdmer, N., Chidambarrao, D., Williams, R., McCullen, J., Slisher, D., Springer, S., Crabbe, E., Freeman, G.
المصدر: 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
الإتاحة: https://doi.org/10.1109/asmc.2007.375097Test
http://xplorestaging.ieee.org/ielx5/4259214/4259215/04259263.pdf?arnumber=4259263Test -
6مؤتمر
المؤلفون: Liang, Q., Kawamura, T., Ketchen, M., Kawanaka, S., Pelella, Mario, Robertson, D., Bhushan, M., Mcstay, K., Freeman, G., Miyamoto, K., Leobandung, E., Huang, S.
المصدر: 2006 IEEE international SOI Conferencee Proceedings ; ISSN 1078-621X
الإتاحة: https://doi.org/10.1109/soi.2006.284450Test
http://xplorestaging.ieee.org/ielx5/4062841/4062842/04062898.pdf?arnumber=4062898Test -
7مؤتمر
المؤلفون: Leobandung, E., Nayakama, H., Mocuta, D., Miyamoto, K., Angyal, M., Meer, H.V., McStay, K., Ahsan, I., Allen, S., Azuma, A., Belyansky, M., Bentum, R.-V., Cheng, J., Chidambarrao, D., Dirahoui, B., Fukasawa, M., Gerhardt, M., Gribelyuk, M., Halle, S., Harifuchi, H., Harmon, D., Heaps-Nelson, J., Hichri, H., Ida, K., Inohara, M., Inoue, K., Jenkins, K., Kawamura, T., Kim, B., Ku, S.-K., Kumar, M., Lane, S., Liebmann, L., Logan, R., Melville, I., Miyashita, K., Mocuta, A., O'Neil, P., Ng, M.-F., Nogami, T., Nomura, A., Norris, C., Nowak, E., Ono, M., Panda, S., Penny, C., Radens, C., Ramachandran, R., Ray, A., Rhee, S.-H.
المصدر: Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005.
الإتاحة: https://doi.org/10.1109/.2005.1469238Test
http://xplorestaging.ieee.org/ielx5/9911/31516/01469238.pdf?arnumber=1469238Test -
8مؤتمر
المؤلفون: Chidambarrao, D., McStay, K., Weybright, M., Mandelman, J., Beintner, J., Li, Y., Crabbe, E.
المصدر: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers. (IEEE Cat. No.03TH8672)
الإتاحة: https://doi.org/10.1109/vtsa.2003.1252542Test
http://xplorestaging.ieee.org/ielx5/8875/28033/01252542.pdf?arnumber=1252542Test -
9مؤتمر
المؤلفون: Beintner, J., Li, Y., Casarotto, D., Chidambarrao, D., McStay, K., Wang, G., Hummler, K., Divakaruni, R., Bergner, W., Crabbe, E., Mueller, W., Poechmueller, P., Bronner, G.
المصدر: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers. (IEEE Cat. No.03TH8672)
الإتاحة: https://doi.org/10.1109/vtsa.2003.1252598Test
http://xplorestaging.ieee.org/ielx5/8875/28033/01252598.pdf?arnumber=1252598Test -
10مؤتمر
المؤلفون: Kawanaka, S., Utomo, H., Nii, H., Harifuchi, H., Sudo, G., Rausch, W., Kimura, H., Nakao, T., Park, H., Oh, S.-H., Waite, A., Ketchen, M.B., Womack, S., Narasimha, S., Mocuta, A.C., Ajmera, A., Li, Y., Malik, R., Kohyama, Y., Cheek, J., Yang, I., Clark, W.F., Bhushan, M., Divakaruni, R., Pearson, D.J., Bhasin, R., Mcstay, K., Sherony, M., Fisher, P., Matsumoto, K.
المصدر: 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573)
الإتاحة: https://doi.org/10.1109/soi.2004.1391537Test
http://xplorestaging.ieee.org/ielx5/9580/30296/01391537.pdf?arnumber=1391537Test