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1دورية أكاديمية
المؤلفون: Philip H. Li, Elaine Y. L. Au, Si-Leong Cheong, Ling Chung, Ka I. Fan, Marco H. K. Ho, Agnes S. Y. Leung, Martin M. H. Chung, Jane C. Y. Wong, Ricardo Coelho
المصدر: Frontiers in Allergy, Vol 4 (2023)
مصطلحات موضوعية: angioedema, hereditary, hives, Hong Kong, Macau, referral, Immunologic diseases. Allergy, RC581-607
وصف الملف: electronic resource
العلاقة: https://www.frontiersin.org/articles/10.3389/falgy.2023.1290021/fullTest; https://doaj.org/toc/2673-6101Test
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2دورية أكاديمية
المؤلفون: D. S. Jones, E. Ohtsuka, H. Inoue, H. Ishikawa, H. Kamiya, H. Kasai, M. H. Chung, S. Nishimura
المصدر: The Journal of Toxicological Sciences. 1991, 16(SupplementI):95
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3Translation and validation of the Depression Anxiety Stress Scales for menopausal women in Indonesia
المؤلفون: H. D. Susanti, I. Sonko, M.-H. Chung
المصدر: Climacteric. 25:483-489
مصطلحات موضوعية: Cross-Sectional Studies, Psychometrics, Depression, Indonesia, Surveys and Questionnaires, Humans, Reproducibility of Results, Obstetrics and Gynecology, Female, General Medicine, Anxiety, Menopause
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb23f24ef32febdf825661d76291031bTest
https://doi.org/10.1080/13697137.2022.2052839Test -
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المؤلفون: Y. S. Zou, M. H. Chung, C. L. Gan, Jeremy Chen, Claire Hsu, Hem Takiar
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::84cc52ceb553b3979881882e31b32876Test
https://doi.org/10.1109/eptc56328.2022.10013228Test -
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المؤلفون: Y. Y. Chen, W. J. Liu, Y. S. Zou, M. H. Chung, C. L. Gan, Hem Takiar
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::4296e5313dfd4a0b9676c69947a9bca0Test
https://doi.org/10.1109/eptc56328.2022.10013229Test -
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المؤلفون: Y. S. Zou, M. H. Chung, C. L. Gan, Yun Ting Hsu, Hem Takiar
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::5ff2101669bba9e03bf22ae253dab855Test
https://doi.org/10.1109/eptc53413.2021.9663897Test -
7دورية أكاديمية
المؤلفون: S.-H. Wie, M. Ki, J. Kim, Y. K. Cho, S.-K. Lim, J. S. Lee, K. T. Kwon, H. Lee, H. J. Cheong, D. W. Park, S. Y. Ryu, M.-H. Chung, H. Pai
المساهمون: 류성열, Ryu, Seong Yeol, Dept. of Internal Medicine (내과학)
العلاقة: Clinical Microbiology and Infection, Vol.20(10) : 721-729, 2014; oak-aaa-01441; http://kumel.medlib.dsmc.or.kr/handle/2015.oak/35453Test; https://www.sciencedirect.com/science/article/pii/S1198743X14654124?via%3DihubTest
الإتاحة: https://doi.org/10.1111/1469-0691.12500Test
http://kumel.medlib.dsmc.or.kr/handle/2015.oak/35453Test
https://www.sciencedirect.com/science/article/pii/S1198743X14654124?via%3DihubTest -
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المؤلفون: Chong Leong Gan, Hem Takiar, C. M. Chen, Y. S. Zou, M. H. Chung
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: Materials science, Bending (metalworking), business.industry, Soldering, Drop (telecommunication), Semiconductor package, Structural engineering, business, Daisy chain, Drop test, Joint (geology), Die (integrated circuit)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::83d9ceb571eea861b5387adef75d45d3Test
https://doi.org/10.1109/eptc50525.2020.9315075Test -
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المؤلفون: Hem Takiar, Y. S. Zou, Chong Leong Gan, M. H. Chung, Yun Ting Hsu, Tracy Tennant
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: Shear (sheet metal), Materials science, Organic solderability preservative, Soldering, Shear strength, Intermetallic, Temperature cycling, Direct shear test, Composite material, Surface finishing
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::4a3ecac11d847c68240aabded9e83a48Test
https://doi.org/10.1109/eptc50525.2020.9315072Test -
10دورية أكاديمية
المؤلفون: M. H. Chung, B. Y. Lee, Y. Kim, E. K. Rhee
مصطلحات موضوعية: Energy consumption, energy performance assessment, mobile application, university buildings
العلاقة: https://zenodo.org/communities/wasetTest; https://zenodo.org/record/1089253Test; https://doi.org/10.5281/zenodo.1089253Test; oai:zenodo.org:1089253
الإتاحة: https://doi.org/10.5281/zenodo.1089253Test
https://doi.org/10.5281/zenodo.1089252Test
https://zenodo.org/record/1089253Test