المؤلفون: Ku, Yi-Sha, Lo, Chun-Wei, Lee, Cheng-Kang, Cho, Chia-Hung, Cheah, Wen-Qii, Chou, Po-Wen

المصدر: Metrology; Dec2023, Vol. 3 Issue 4, p365-376, 12p

مصطلحات موضوعية: SPECTROMETRY, GAIN measurement, SILICON, ARTIFICIAL neural networks, REFLECTOMETER

المؤلفون: Ku, Yi-Sha, Wang, Wei-Ting, Chen, Yi-Chang, Chen, Ming-Chang, Yeh, Chia-Liang, Lo, Chun-Wei

المساهمون: Adan, Ofer, Robinson, John C.

المصدر: Metrology, Inspection, and Process Control for Microlithography XXXIV

الإتاحة: https://doi.org/10.1117/12.2552218Test

المؤلفون: 羅俊瑋, Lo, Chun-Wei

مصطلحات موضوعية: 最大誠信原則, 海上保險, 海上保險法, 保險契約, UTMOST GOOD FAITH, MARINE INSURANCE, MARINE INSURANCE ACT 1906, INSURANCE CONTRACT

الإتاحة: http://thesis.lib.nccu.edu.tw/cgi-bin/cdrfb3/gsweb.cgi?o=dstdcdr&i=sid=%22G0093358502%22Test.

المؤلفون: Cho, Chia-Hung, Ku, Yi-Sha, Chang, Po-Yi, Lee, Han-Wen, Lo, Chun-Wei, Chen, Yi-Chang

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC)

الإتاحة: https://doi.org/10.23919/iwlpc.2019.8914147Test
http://xplorestaging.ieee.org/ielx7/8902179/8913841/08914147.pdf?arnumber=8914147Test

المؤلفون: Ku, Yi-Sha, Chang, Po-Yi, Lee, Han-Wen, Lo, Chun-Wei, Chen, Yi-Chang, Cho, Chia-Hung

المصدر: Applied Sciences (2076-3417); Jan2022, Vol. 12 Issue 2, p898, 15p

مصطلحات موضوعية: METROLOGY, REFLECTOMETRY, ELECTRONIC data processing, MEASUREMENT

المؤلفون: Ting, Tah-Kang Joseph, Wang, Gyh-Bin, Wang, Ming-Hung, Wu, Chun-Peng, Wang, Chun-Kai, Lo, Chun-Wei, Tien, Li-Chin, Yuan, Der-Min, Hsieh, Yung-Ching, Lai, Jenn-Shiang, Hsu, Wen-Pin, Huang, Chien-Chih, Chen, Chi-Kang, Chou, Yung-Fa, Kwai, Ding-Ming, Wang, Zhe, Wu, Wei, Tomishima, Shigeki, Stolt, Pat, Lu, Shih-Lien

المصدر: 2017 IEEE International Solid-State Circuits Conference (ISSCC)

الإتاحة: https://doi.org/10.1109/isscc.2017.7870432Test
http://xplorestaging.ieee.org/ielx7/7866667/7870233/07870432.pdf?arnumber=7870432Test