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1مؤتمر
المؤلفون: Nguyen, Son Van, Shobha, H., Haigh, T., Chen, J., Lee, J., Nogami, T., Liniger, E., Cohen, S., Hu, C. K., Huang, H., Yao, Y., Canaperi, D., Peethala, B., Standaert, T., Bonilla, G.
المصدر: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
الإتاحة: https://doi.org/10.1109/vlsi-tsa48913.2020.9203631Test
http://xplorestaging.ieee.org/ielx7/9199081/9203570/09203631.pdf?arnumber=9203631Test -
2دورية أكاديمية
المؤلفون: Thouless, M. D., Jensen, H. M., Liniger, E. G.
المصدر: Proceedings: Mathematical and Physical Sciences, 1994 Nov 01. 447(1930), 271-279.
الوصول الحر: https://www.jstor.org/stable/52616Test
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3دورية أكاديمية
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4دورية أكاديمية
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5دورية أكاديمية
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6دورية أكاديمية
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7مؤتمر
المؤلفون: Penny, C., Gates, S., Peethala, B., Lee, J., Priyadarshini, D., Nguyen, S., McLaughlin, P., Liniger, E., Hu, C.-K., Clevenger, L., Hook, T., Shobha, H., Kerber, P., Seshadri, I., Chen, J., Edelstein, D., Quon, R., Bonilla, G., Paruchuri, V., Huang, E.
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2017.7968970Test
http://xplorestaging.ieee.org/ielx7/7961614/7968934/07968970.pdf?arnumber=7968970Test -
8مؤتمر
المؤلفون: Priyadarshini, Deepika, Nguyen, S., Shobha, H., Cohen, S., Shaw, T., Parks, C., Adams, E., Burnham, J., Liniger, E., Hu, C.K., Collins, D., Spooner, T., Grill, A., Canaperi, D., Paruchuri, Vamsi, Edelstein, D.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2016.7507693Test
http://xplorestaging.ieee.org/ielx7/7502234/7507634/07507693.pdf?arnumber=7507693Test -
9مؤتمر
المؤلفون: Yang, C.-C., Spooner, T., Wang, W., Maniscalco, J., McLaughlin, P., Hu, C.K., Liniger, E., Standaert, T., Canaperi, D., Quon, R., Huang, E., Edelstein, D.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2016.7507692Test
http://xplorestaging.ieee.org/ielx7/7502234/7507634/07507692.pdf?arnumber=7507692Test -
10مؤتمر
المؤلفون: Kelly, J., Chen, J. H.-C., Huang, H., Hu, C. K., Liniger, E., Patlolla, R., Peethala, B., Adusumilli, P., Shobha, H., Nogami, T., Spooner, T., Huang, E., Edelstein, D., Canaperi, D., Kamineni, V., Mont, F., Siddiqui, S.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2016.7507673Test
http://xplorestaging.ieee.org/ielx7/7502234/7507634/07507673.pdf?arnumber=7507673Test