المؤلفون: Villa, Davide, Lin, Chih-Kuang, Kuenzi, Adam, Lang, Michael

مصطلحات موضوعية: Computer Science - Networking and Internet Architecture

الوصول الحر: http://arxiv.org/abs/2208.04050Test

المؤلفون: Tran, Duc, Lin, Chih-Kuang, Tung, Pi-Cheng, Ho, Jeng-Rong, Le, Thanh-Long

المساهمون: National Science and Technology Council, Ministry of Science and Technology, Taiwan

المصدر: Journal of Materials Research and Technology ; volume 29, page 1278-1292 ; ISSN 2238-7854

مصطلحات موضوعية: Metals and Alloys, Surfaces, Coatings and Films, Biomaterials, Ceramics and Composites

الإتاحة: https://doi.org/10.1016/j.jmrt.2024.01.174Test
https://api.elsevier.com/content/article/PII:S2238785424001741?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S2238785424001741?httpAccept=text/plainTest

المؤلفون: Tomaszewski, Lechosław, Kołakowski, Robert, Mesodiakaki, Agapi, Ntontin, Konstantinos, Antonopoulos, Angelos, Pappas, Nikolaos, Fiore, Marco, Mosahebfard, Mohammadreza, Watts, Simon, Harris, Philip, Lin, Chih-Kuang, Santiago, Ana Rita, Lazarakis, Fotis, Chatzinotas, Symeon

العلاقة: info:eu-repo/grantAgreement/EC/HE/101096526/; https://zenodo.org/communities/ether-projectTest; https://zenodo.org/record/7955005Test; https://doi.org/10.5281/zenodo.7955005Test; oai:zenodo.org:7955005

الإتاحة: https://doi.org/10.5281/zenodo.7955005Test
https://doi.org/10.5281/zenodo.7955004Test
https://zenodo.org/record/7955005Test

المؤلفون: Ho, Yi-Mo, Lee, Cheng-Hsun, Ho, Jeng-Rong, Lin, Chih-Kuang, Tung, Pi-Cheng, Lee, Yuan-Shin

المساهمون: North Carolina State University, Ministry of Science and Technology, Taiwan

المصدر: Manufacturing Letters ; volume 35, page 160-165 ; ISSN 2213-8463

مصطلحات موضوعية: Industrial and Manufacturing Engineering, Mechanics of Materials

الإتاحة: https://doi.org/10.1016/j.mfglet.2023.08.003Test
https://api.elsevier.com/content/article/PII:S2213846323000603?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S2213846323000603?httpAccept=text/plainTest

المؤلفون: Nguyen, Hoai-Tan¹ (AUTHOR), Lin, Chih-Kuang² (AUTHOR), Tung, Pi-Cheng² (AUTHOR), Nguyen, Van-Cuong¹ (AUTHOR), Ho, Jeng-Rong² (AUTHOR) jrho@ncu.edu.tw

المصدر: International Journal of Advanced Manufacturing Technology. Jul2024, Vol. 133 Issue 1/2, p199-220. 22p.

المؤلفون: Nguyen, Hoai¹ (AUTHOR), Lin, Chih-Kuang¹ (AUTHOR), Tung, Pi-Cheng¹ (AUTHOR), Ho, Jeng-Rong¹ (AUTHOR) jrho@ncu.edu.tw

المصدر: Ceramics International. Jun2024, Vol. 50 Issue 12, p21788-21799. 12p.

مصطلحات موضوعية: *LASER welding, *PULSED lasers, *LASER pulses, *BRITTLE fractures, *MICROSTRUCTURE, *WELDING, *EUTECTICS

المؤلفون: Tran, Duc, Lin, Chih-Kuang, Tung, Pi-Cheng, Lin, Chin-Te, Ho, Jeng-Rong, Iizuka, Yoshiyuki, Tsao, I-Yu, Le, Thanh-Long

المصدر: Materials Science and Engineering: A ; volume 900, page 146438 ; ISSN 0921-5093

مصطلحات موضوعية: Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science

الإتاحة: https://doi.org/10.1016/j.msea.2024.146438Test
https://api.elsevier.com/content/article/PII:S0921509324003691?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0921509324003691?httpAccept=text/plainTest

المؤلفون: Liao, Wei-Xiang, Lee, Wei-Ting, Lin, Chih-Kuang, Tung, Pi-Cheng, Ho, Jeng-Rong

المصدر: Optics and Lasers in Engineering ; volume 178, page 108162 ; ISSN 0143-8166

مصطلحات موضوعية: Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1016/j.optlaseng.2024.108162Test
https://api.elsevier.com/content/article/PII:S0143816624001416?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0143816624001416?httpAccept=text/plainTest

المؤلفون: Jiang, Chong-Ming, Ho, Jeng-Rong, Tung, Pi-Cheng, Lin, Chih-Kuang

المساهمون: Ministry of Science and Technology, Ministry of Science and Technology, Taiwan

المصدر: International Journal of Fatigue ; volume 179, page 108060 ; ISSN 0142-1123

مصطلحات موضوعية: Industrial and Manufacturing Engineering, Mechanical Engineering, Mechanics of Materials, General Materials Science, Modeling and Simulation

الإتاحة: https://doi.org/10.1016/j.ijfatigue.2023.108060Test
https://api.elsevier.com/content/article/PII:S0142112323005613?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0142112323005613?httpAccept=text/plainTest

المؤلفون: Cao, Hoang-Tien, Ho, Jeng-Rong, Tung, Pi-Cheng, Lin, Yuan-Ting, Lin, Chih-Kuang

المساهمون: Ministry of Science and Technology, Ministry of Science and Technology, Taiwan

المصدر: Materials Science in Semiconductor Processing ; volume 169, page 107911 ; ISSN 1369-8001

مصطلحات موضوعية: Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science

الإتاحة: https://doi.org/10.1016/j.mssp.2023.107911Test
https://api.elsevier.com/content/article/PII:S1369800123006042?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S1369800123006042?httpAccept=text/plainTest