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1دورية أكاديمية
المؤلفون: Lee, Sanggu, Kim, Yoona, Lee, Dusol, Choi, Inhyuk, Kim, Jihong
المساهمون: Lee, Sanggu
العلاقة: HotStorage 2022 - Proceedings of the 2022 14th ACM Workshop on Hot Topics in Storage and File Systems, pp.113-118; https://hdl.handle.net/10371/184813Test; 2-s2.0-85134187465; 168979
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2دورية أكاديمية
المؤلفون: Kim, Myungsuk, Chun, Myoungjun, Hong, Duwon, Kim, Yoona, Cho, Geonhee, Lee, Dusol, Kim, Ji Hong
المساهمون: Kim, Ji Hong
العلاقة: Performance Evaluation Review, Vol.48 No.3, pp.120-121; https://hdl.handle.net/10371/183756Test; 2-s2.0-85102180765; 160562
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3مؤتمرP2Cache: An Application-Directed Page Cache for Improving Performance of Data-Intensive Applications
المؤلفون: Lee, Dusol, Choi, Inhyuk, Lee, Chanyoung, Lee, Sungjin, Kim, Jihong
العلاقة: http://hdl.handle.net/20.500.11750/47775Test; 2-s2.0-85168388659; ACM Workshop on Hot Topics in Storage and File Systems (HotStorage 2023), pp.31 - 36; https://www.hotstorage.org/2023/program.htmlTest
الإتاحة: https://doi.org/20.500.11750/47775Test
https://doi.org/10.1145/3599691.3603408Test
https://hdl.handle.net/20.500.11750/47775Test
https://www.hotstorage.org/2023/program.htmlTest -
4دورية أكاديمية
المؤلفون: Lee, Dusol, Hong, Duwon, Choi, Wonil, Kim, Jihong
المساهمون: SNU-SK Hynix Solution Research Center, National Research Foundation of Korea, Ministry of Science and ICT, South Korea
المصدر: IEEE Computer Architecture Letters ; volume 21, issue 1, page 13-16 ; ISSN 1556-6056 1556-6064 2473-2575
الإتاحة: https://doi.org/10.1109/lca.2022.3144773Test
http://xplorestaging.ieee.org/ielx7/10208/9667160/09691807.pdf?arnumber=9691807Test -
5دورية أكاديمية
المؤلفون: Kim, Myungsuk, Chun, Myoungjun, Hong, Duwon, Kim, Yoona, Cho, Geonhee, Lee, Dusol, Kim, Jihong
المساهمون: Samsung
المصدر: Performance Evaluation ; volume 145, page 102153 ; ISSN 0166-5316
مصطلحات موضوعية: Computer Networks and Communications, Hardware and Architecture, Modeling and Simulation, Software
الإتاحة: https://doi.org/10.1016/j.peva.2020.102153Test
https://api.elsevier.com/content/article/PII:S0166531620300730?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0166531620300730?httpAccept=text/plainTest
