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1
المؤلفون: Hongyu Li, Hong Miao Ji, Gim Guan Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K.-J. Chui
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::3f01db4d6bec3181adcdb2acce0d9202Test
https://doi.org/10.1109/eptc56328.2022.10013123Test -
2
المؤلفون: Hong Miao Ji, Gim Guan Chen, K.-J. Chui
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::e809664655c216d4e6247c8a7281ff5bTest
https://doi.org/10.1109/eptc56328.2022.10013244Test -
3
المؤلفون: S. Bhattacharya, T. G. Lim, D. Ho, K. J. Chui, X. W. Zhang, M. D. Rotaru, B. G. Sajay, T. C. Chai, S. C. Chong, H. Y. Li, S. Lim, X. Y. Wang, M. C. Jong, V. N. Sekhar, R. Dutta, Vempati S. Rao
المصدر: 2022 International Electron Devices Meeting (IEDM).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::c4ab03660be3934f3942852eac1139caTest
https://doi.org/10.1109/iedm45625.2022.10019429Test -
4
المؤلفون: Woon Leng Loh, Lim Teck Guan, K.-J. Chui
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::abeb76587fd9cd9edf499bba477d9101Test
https://doi.org/10.1109/eptc53413.2021.9663901Test -
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المؤلفون: Jeffrey B.W. Soon, K J Chui, Yu Mingbin, Guan-Kian Lau, Hongyu Li
المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
مصطلحات موضوعية: Microelectromechanical systems, Fabrication, Materials science, Silicon, Through-silicon via, business.industry, Silicon on insulator, chemistry.chemical_element, Substrate (electronics), chemistry, Etching (microfabrication), Process integration, Electronic engineering, Optoelectronics, business
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::2d465c47fbf4b26c725552dc4518f483Test
https://doi.org/10.1109/eptc.2015.7412340Test