المؤلفون: Meena, Jagan Singh, Choi, Su Bin, Jung, Seung-Boo, Kim, Jong-Woong

المساهمون: National Research Foundation of Korea, Ministry of Education

المصدر: Materials Today Bio ; volume 19, page 100565 ; ISSN 2590-0064

الإتاحة: https://doi.org/10.1016/j.mtbio.2023.100565Test
https://api.elsevier.com/content/article/PII:S259000642300025X?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S259000642300025X?httpAccept=text/plainTest

المؤلفون: Choi, Jun Sang, Meena, Jagan Singh, Choi, Su Bin, Jung, Seung‐Boo, Kim, Jong‐Woong

المصدر: Small; 5/25/2024, Vol. 20 Issue 20, p1-12, 12p

المؤلفون: Saeed, Aiman, Zaidi, Syed Farrukh Alam, Mun, Junyoung, Cho, Hyung Koun, Jung, Seung-Boo, Lee, Nae-Eung, Park, Chun Gwon, Lee, Jung Heon

المصدر: Journal of Materials Chemistry C; 5/7/2024, Vol. 12 Issue 17, p6213-6225, 13p

المؤلفون: Go, Hyeri, Noh, Taejoon, Jung, Seung-Boo, Sohn, Yoonchul

المصدر: Crystals (2073-4352); May2024, Vol. 14 Issue 5, p465, 10p

مصطلحات موضوعية: SOLDER & soldering, IRRADIATION, INTERMETALLIC compounds, SOLDER pastes, IMPACT (Mechanics), TIN alloys

المؤلفون: Jeong, Geon-Joo, Kim, Tae-Yoo, Jung, Seung-Boo, Kim, Kwang-Seok

المصدر: 2024 International Conference on Electronics Packaging (ICEP)

الإتاحة: https://doi.org/10.23919/icep61562.2024.10535656Test
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535656.pdf?arnumber=10535656Test

المؤلفون: Noh, Taejoon, Jeong, Haksan, Jung, Seung-Boo

المساهمون: Ministry of Science and ICT, South Korea, Korea Evaluation Institute of Industrial Technology

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; page 1-1 ; ISSN 2156-3950 2156-3985

الإتاحة: https://doi.org/10.1109/tcpmt.2024.3409753Test
http://xplorestaging.ieee.org/ielx8/5503870/5673025/10550003.pdf?arnumber=10550003Test

المؤلفون: Jeong, Jong-Min, Kim, Dongjin, Kim, Jungsoo, Bang, Junghwan, Jung, Seung-Boo, Kim, Min-Su

المساهمون: Incheon Metropolitan City, Korea Institute of Industrial Technology, Ministry of Trade, Industry and Energy

المصدر: Journal of Materials Science: Materials in Electronics ; volume 35, issue 4 ; ISSN 0957-4522 1573-482X

مصطلحات موضوعية: Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1007/s10854-023-11913-6Test

المؤلفون: Son, Jae-yeol, Kang, Donggil, Jeong, Haksan, Jung, Seung-Boo

المصدر: Journal of Materials Science: Materials in Electronics; Mar2024, Vol. 35 Issue 7, p1-9, 9p

المؤلفون: Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-Won

المصدر: Journal of Alloys and Compounds ; volume 890, page 161778 ; ISSN 0925-8388

مصطلحات موضوعية: Materials Chemistry, Metals and Alloys, Mechanical Engineering, Mechanics of Materials

الإتاحة: https://doi.org/10.1016/j.jallcom.2021.161778Test
https://api.elsevier.com/content/article/PII:S092583882103187X?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S092583882103187X?httpAccept=text/plainTest

المؤلفون: Yoon, Jeong-Won, Chun, H. -S., Koo, Ja-Myeong, Jung, Seung-Boo

المصدر: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

مصطلحات موضوعية: Computer Science - Other Computer Science

الوصول الحر: http://arxiv.org/abs/0711.3323Test