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1دورية أكاديمية
المؤلفون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, J.-C., Weber, O., Turgis, D., Valery, A., Medico, S. Del, Caubet, V., Reynard, J.-P., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.
المساهمون: STMicroelectronics
المصدر: IEEE Journal of the Electron Devices Society ; volume 10, page 563-568 ; ISSN 2168-6734
مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biotechnology
الإتاحة: https://doi.org/10.1109/jeds.2022.3162755Test
http://xplorestaging.ieee.org/ielx7/6245494/9714452/09743565.pdf?arnumber=9743565Test -
2دورية أكاديمية
المؤلفون: Gomiero, E., Ristoiu, D., Reynard, J. P., Clement, L., Zuliani, P., Annunziata, R., Arnaud, F., Samanni, G., Jasse, J., Jahan, C., Weber, O., Berthelon, R., Ranica, R., Favennec, L., Caubet, V.
المصدر: IEEE Journal of the Electron Devices Society ; volume 7, page 517-521 ; ISSN 2168-6734
مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biotechnology
الإتاحة: https://doi.org/10.1109/jeds.2019.2913467Test
http://xplorestaging.ieee.org/ielx7/6245494/8656606/08704299.pdf?arnumber=8704299Test -
3مؤتمر
المؤلفون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, JC., Weber, O., Turgis, D., Valery, A., Del Medico, S., Caubet, V., Reynard, JP., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.
المساهمون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, Jc., Weber, O., Turgis, D., Valery, A., Del Medico, S., Caubet, V., Reynard, Jp., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.
العلاقة: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-3748-6; info:eu-repo/semantics/altIdentifier/wos/WOS:000790809500054; ispartofbook:ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC); ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC); firstpage:231; lastpage:234; numberofpages:4; http://hdl.handle.net/11311/1194824Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85123399613
الإتاحة: https://doi.org/10.1109/ESSDERC53440.2021.9631807Test
http://hdl.handle.net/11311/1194824Test -
4مؤتمر
المؤلفون: Ranica, R., Berthelon, R., Gandolfo, A., Samanni, G., Gomiero, E., Jasse, J., Mattavelli, P., Sandrini, J., Querre, M., Le-Friec, Y., Poulet, J., Caubet, V., Favennec, L., Boccaccio, C., Ghezzi, G., Gallon, C., Grenier, JC., Dumont, B., Weber, O., Villaret, A., Beneyton, R., Cherault, N., Ristoiu, D., Del Medico, S., Kermarrec, O., Reynard, JP., Boivin, P., Souhaite, A., Desvoivres, L., Chouteau, S., Sassoulas, PO., Clement, L., Valery, A., Petroni, E., Turgis, D., Lippiello, A., Scotti, L., Disegni, F., Ventre, A., Ornaghi, D., De Tomasi, M., Maurelli, A., Conte, A., Arnaud, F., Redaelli, A., Annunziata, R., Cappelletti, P., Piazza, F., Ferreira, P., Gonella, R.
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM)
الإتاحة: https://doi.org/10.1109/iedm19574.2021.9720669Test
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720669.pdf?arnumber=9720669Test -
5مؤتمرHigh Density Embedded PCM Cell in 28nm FDSOI Technology for Automotive Micro-Controller Applications
المؤلفون: Arnaud, F., Ferreira, P., Piazza, F., Gandolfo, A., Zuliani, P., Mattavelli, P., Gomiero, E., Samanni, G., Jasse, J., Jahan, C., Reynard, J. P., Berthelon, R., Weber, O., Villaret, A., Dumont, B., Grenier, J. C., Ranica, R., Gallon, C., Boccaccio, C., Souhaite, A., Desvoivres, L., Ristoiu, D., Favennec, L., Caubet, V., Delmedico, S., Cherault, N., Beneyton, R., Chouteau, S., Sassoulas, P. O., Clement, L., Boivin, P., Turgis, D., Disegni, F., Ogier, J. L., Federspiel, X., Kermarrec, O., Molgg, M., Viscuso, A., Annunziata, R., Maurelli, A., Cappelletti, P., Ciantar, E.
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM)
الإتاحة: https://doi.org/10.1109/iedm13553.2020.9371934Test
http://xplorestaging.ieee.org/ielx7/9371868/9371888/09371934.pdf?arnumber=9371934Test -
6مؤتمر
المؤلفون: Federspiel, X., Jasse, J., Ney, D., Roy, D., Rafik, M.
المصدر: 2019 IEEE International Integrated Reliability Workshop (IIRW)
الإتاحة: https://doi.org/10.1109/iirw47491.2019.8989883Test
http://xplorestaging.ieee.org/ielx7/8976314/8989871/08989883.pdf?arnumber=8989883Test