-
1مؤتمر
المؤلفون: Fan, S.-C., Jamison, P., Pancharatnam, S., Sankarapandian, M., Xie, R., Waskiewicz, C., Strane, J., Lee, J., Shobha, H., Demarest, J., Peethala, C., Jagannathan, H., Wynne, J.
المصدر: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
الإتاحة: https://doi.org/10.1109/asmc57536.2023.10121123Test
http://xplorestaging.ieee.org/ielx7/10121052/10121025/10121123.pdf?arnumber=10121123Test -
2دورية أكاديمية
المؤلفون: Roozeboom, F Fred, Timans, PJ, Kakushima, K, Gusev, EP, Karim, Z, Misra, D, Obeng, Y, Gendt, Stefan De, Jagannathan, H
المصدر: ISSN:1938-6737 1938-5862.
وصف الملف: application/pdf
العلاقة: http://repository.tue.nl/913051Test
الإتاحة: http://repository.tue.nl/913051Test
-
3دورية أكاديمية
المؤلفون: Roozeboom, F., Timans, P.J., Kakushima, K., Gusev, E.P., Karim, Z., Misra, D., Obeng, Y., De Gendt, S., Jagannathan, H.
المصدر: Roozeboom , F , Timans , P J , Kakushima , K , Gusev , E P , Karim , Z , Misra , D , Obeng , Y , De Gendt , S & Jagannathan , H 2019 , ' Preface : Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9 ' , ECS Transactions , vol. 89 , no. 3 , pp. III . < http://ecst.ecsdl.org/content/89/3/local/front-matter.pdfTest >
-
4مؤتمر
المؤلفون: Tsutsui, G., Song, S., Strane, J., Xie, R., Qin, L., Zhang, C., Schmidt, D., Fan, S., Hong, B., Jung, Y., Sohn, C-W., Hwang, I., Yim, J., Son, G. H., Jo, G., Kim, K-I., Sankarapandian, M., Mochizuki, S., Seshadri, I., Miller, E., Li, J., Demarest, J., Waskiewicz, C., Southwick, R. G., Zhou, H., Pujari, R. N., Nieves, P., Wang, M., Jagannathan, H., Anderson, B., Guo, D., Divakaruni, R., Wu, T., Seo, K-I., Bu, H.
المساهمون: Research and Development
المصدر: 2022 International Electron Devices Meeting (IEDM)
الإتاحة: https://doi.org/10.1109/iedm45625.2022.10019393Test
http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019393.pdf?arnumber=10019393Test -
5دورية أكاديمية
المؤلفون: Roozeboom, F Fred, Timans, PJ, Kakushima, K, Jagannathan, H, Karim, Z, Gusev, EP, Gendt, Stefan De
المصدر: ISSN:1938-6737 1938-5862.
وصف الملف: application/pdf
العلاقة: http://repository.tue.nl/902474Test
الإتاحة: http://repository.tue.nl/902474Test
-
6مؤتمر
المؤلفون: Jagannathan, H., Anderson, B., Sohn, C-W., Tsutsui, G., Strane, J., Xie, R., Fan, S., Kim, K-I., Song, S., Sieg, S., Seshadri, I., Mochizuki, S., Wang, J., Rahman, A., Cheon, K-Y., Hwang, I., Demarest, J., Do, J., Fullam, J., Jo, G., Hong, B., Jung, Y., Kim, M., Kim, S., Lallement, R., Levin, T., Li, J., Miller, E., Montanini, P., Pujari, R., Osborn, C., Sankarapandian, M., Son, G-H., Waskiewicz, C., Wu, H., Yim, J., Young, A., Zhang, C., Varghese, A., Robison, R., Burns, S., Zhao, K., Yamashita, T., Dechene, D., Guo, D., Divakaruni, R., Wu, T., Seo, K-I., Bu, H.
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM)
الإتاحة: https://doi.org/10.1109/iedm19574.2021.9720561Test
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720561.pdf?arnumber=9720561Test -
7دورية
المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Senapati, B., Do, J., Young, A., Dechene, D. J., S, Song, Park, Y., Kong, J., Lanzillo, N., Zhang, C., Fan, S., Baek, S., Mukesh, S., Jagannathan, H., Anderson, B., Wu, T., Guo, D., Seo, K.-I., Bu, H.
المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124950L-124950L-6, 1124557p
-
8مؤتمر
المؤلفون: Mochizuki, S., Colombeau, B., Zhang, J., Kung, S. C., Stolfi, M., Zhou, H., Breton, M., Watanabe, K., Li, J., Jagannathan, H., Cogorno, M., Mandrekar, T., Chen, P., Loubet, N., Natarajan, S., Haran, B.
المصدر: 2020 IEEE Symposium on VLSI Technology
الإتاحة: https://doi.org/10.1109/vlsitechnology18217.2020.9265097Test
http://xplorestaging.ieee.org/ielx7/9264988/9264985/09265097.pdf?arnumber=9265097Test -
9
المؤلفون: Jagannathan, H., Timans, Paul J., Kakushima, K., Gusev, Evgeni P., Karim, Z., Misra, D., Obeng, Y., De Gendt, Stefan, Roozeboom, Fred
المساهمون: Plasma & Materials Processing
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=narcis______::fa09d70d2ba0a956c26c4b21b31ae9dbTest
https://research.tue.nl/nl/publications/b099e2b3-d9ef-477e-8f52-b73db0d28b2aTest -
10دورية أكاديمية
المؤلفون: Siddiqui, S., Galatage, R., Zhao, W., Muthinti, G. Raja, Fronheiser, J., Srinivasan, P., Triyoso, D.H., Sporer, R., Jagannathan, H., Haran, B., Knorr, A.
المساهمون: IBM Research and Development
المصدر: Microelectronic Engineering ; volume 223, page 111219 ; ISSN 0167-9317
مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials
الإتاحة: https://doi.org/10.1016/j.mee.2020.111219Test
https://api.elsevier.com/content/article/PII:S0167931720300071?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0167931720300071?httpAccept=text/plainTest