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1مؤتمر
المؤلفون: Yang, C.-C., Spooner, T., McLaughlin, P., Hu, C.K., Huang, H., Mignot, Y., Ali, M., Lian, G., Quon, R., Standaert, T., Edelstein, D.
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2017.7968968Test
http://xplorestaging.ieee.org/ielx7/7961614/7968934/07968968.pdf?arnumber=7968968Test -
2مؤتمر
المؤلفون: Priyadarshini, Deepika, Nguyen, S., Shobha, H., Cohen, S., Shaw, T., Parks, C., Adams, E., Burnham, J., Liniger, E., Hu, C.K., Collins, D., Spooner, T., Grill, A., Canaperi, D., Paruchuri, Vamsi, Edelstein, D.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2016.7507693Test
http://xplorestaging.ieee.org/ielx7/7502234/7507634/07507693.pdf?arnumber=7507693Test -
3مؤتمر
المؤلفون: Yang, C.-C., Spooner, T., Wang, W., Maniscalco, J., McLaughlin, P., Hu, C.K., Liniger, E., Standaert, T., Canaperi, D., Quon, R., Huang, E., Edelstein, D.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2016.7507692Test
http://xplorestaging.ieee.org/ielx7/7502234/7507634/07507692.pdf?arnumber=7507692Test -
4مؤتمر
المؤلفون: Priyadarshini, Deepika, Nguyen, S., Shobha, H., Cohen, S., Shaw, T., Liniger, E., Hu, C.K., Parks, C., Adams, E., Burnham, J., Simon, A.H., Bonilla, G., Grill, A., Canaperi, D., Edelstein, D., Collins, D., Balseanu, M., Stolfi, M., Ren, J., Shah, K.
المصدر: IEEE International Interconnect Technology Conference
الإتاحة: https://doi.org/10.1109/iitc.2014.6831866Test
http://xplorestaging.ieee.org/ielx7/6826038/6831822/06831866.pdf?arnumber=6831866Test -
5مؤتمر
المؤلفون: Moy, D., Schadt, M., Hu, C.K., Kaufman, F., Ray, A.K., Mazzeo, N., Baran, E., Pearson, D.J.
المصدر: Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference
الإتاحة: https://doi.org/10.1109/vmic.1989.78072Test
http://xplorestaging.ieee.org/ielx2/871/2576/00078072.pdf?arnumber=78072Test -
6مؤتمر
المؤلفون: Goldblatt, R.D., Agarwala, B., Anand, M.B., Barth, E.P., Biery, G.A., Chen, Z.G., Cohen, S., Connolly, J.B., Cowley, A., Dalton, T., Das, S.K., Davis, C.R., Deutsch, A., DeWan, C., Edelstein, D.C., Emmi, P.A., Faltermeier, C.G., Fitzsimmons, J.A., Hedrick, J., Heidenreich, J.E., Hu, C.K., Hummel, J.P., Jones, P., Kaltalioglu, E., Kastenmeier, B.E., Krishnan, M., Landers, W.F., Liniger, E., Liu, J., Lustig, N.E., Malhotra, S., Manger, D.K., McGahay, V., Mih, R., Nye, H.A., Purushothaman, S., Rathore, H.A., Seo, S.C., Shaw, T.M., Simon, A.H., Spooner, T.A., Stetter, M., Wachnik, R.A., Ryan, J.G.
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
الإتاحة: https://doi.org/10.1109/iitc.2000.854342Test
http://xplorestaging.ieee.org/ielx5/6889/18548/00854342.pdf?arnumber=854342Test -
7مؤتمر
المؤلفون: Kawasaki, H., Hu, C.K.
المصدر: 1996 Symposium on VLSI Technology. Digest of Technical Papers
الإتاحة: https://doi.org/10.1109/vlsit.1996.507848Test
http://xplorestaging.ieee.org/ielx5/3767/11001/00507848.pdf?arnumber=507848Test -
8دورية أكاديمية
المؤلفون: Augur, R., Child, C., Ahn, J.H., Tang, T.J., Clevenger, L., Kioussis, D., Masuda, H., Srivastava, R., Oda, Y., Oguma, H., Quon, R., Kim, B., Sheng, H., Hirooka, S., Gupta, R., Thomas, A., Singh, S.M., Fang, Q., Schiwon, R., Hamieh, B., Wornyo, E., Allen, S., Kaltalioglu, E., Ribes, G., Zhang, G., Fryxell, T., Ogino, A., Shimada, E., Aizawa, H., Minda, H., Kim, S.O., Oki, T., Fujii, K., Pallachalil, M., Takewaki, T., Hu, C.K., Sundlof, B., Permana, D., Bolom, T., Engel, B., Labelle, C., Sapp, B., Nogami, T., Simon, A., Shobha, H., Gates, S., Ryan, E.T., Bonilla, G., Daubenspeck, T., Shaw, T.
المصدر: Microelectronic Engineering ; volume 92, page 42-44 ; ISSN 0167-9317
مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials
الإتاحة: https://doi.org/10.1016/j.mee.2011.04.056Test
https://api.elsevier.com/content/article/PII:S0167931711004801?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0167931711004801?httpAccept=text/plainTest -
9كتاب
المؤلفون: Ho, C., Sun, D.P., Shen, T.J., Ho, N.T., Zou, M., Hu, C.K., Sun, Z.Y., Lukin, J.A.
المصدر: Blood Substitutes, Present and Future Perspectives ; page 281-296
الإتاحة: https://doi.org/10.1016/b978-044420524-7/50023-0Test
https://api.elsevier.com/content/article/PII:B9780444205247500230?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:B9780444205247500230?httpAccept=text/plainTest -
10كتاب
المؤلفون: Alayash, A.I., Alving, B., Armstrong, J.K., Arndt, P.A., Bakker, J.C., Barbucci, R., Biessels, P.T.M., Bleeker, W.K., Bucci, E., Burch, J.M., Burhop, K.E., Caspari, R.F., Chang, T.M.S., Chen, T.J., Cliff, R.O., Cook, B.G., DeWoskin, R., Er, S.S., Fisher, T.C., Fox, P.T., Fratantoni, J.C., Freytag, J.W., Friensenecker, B., Garratty, G., Goda, N., Goins, B., Gorczyns, R.J., Gould, S.A., Greenburg, A.G., Haenel, J.B., Hellums, J.D., Hens, H.J.H., Ho, C., Ho, N.T., Hu, C.K., Ikeda, Y., Intaglietta, M., Ishimura, Y., Jerabek, P.A., Keipert, P.E., Kerger, H., Khalvati, S., Kitabatake, A., Klipper, R., Kobayashi, K., Komatsu, T., Krishnamurti, C., Kwasiboriski, V., Leger, R.M., Lemen, L.
المصدر: Blood Substitutes, Present and Future Perspectives ; page xi-xviii
الإتاحة: https://doi.org/10.1016/b978-044420524-7/50001-1Test
https://api.elsevier.com/content/article/PII:B9780444205247500011?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:B9780444205247500011?httpAccept=text/plainTest