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1رسالة جامعية
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المؤلفون: H.-C. Lam, H.-W. Tseng, Luo-Ping Ger, H.-H. Liou, Chih Kuang Liang
المصدر: Journal of the European Academy of Dermatology and Venereology. 29:1631-1635
مصطلحات موضوعية: Male, medicine.medical_specialty, Multivariate analysis, Cross-sectional study, Taiwan, Dermatology, Logistic regression, Skin Diseases, Diabetes Complications, Diabetes mellitus, Internal medicine, Prevalence, medicine, Scabies, Homes for the Aged, Humans, Aged, Aged, 80 and over, Skin tags, business.industry, Odds ratio, medicine.disease, Surgery, Cross-Sectional Studies, Infectious Diseases, business, Body mass index
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e3400a3f79862dcb54c8d5c6eca0df94Test
https://doi.org/10.1111/jdv.12664Test -
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المؤلفون: H.-W. Tseng, Michelle Ellis, Yijie Zhou, Slim Bouchrara, Robert Keirstead, Paola Newton, Lucy MacGregor
المصدر: Proceedings.
مصطلحات موضوعية: Oceanography, Electrical anisotropy, Geophysics, Geology
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::127790ba1c98b61f14a8848f7a2b838fTest
https://doi.org/10.3997/2214-4609.201701217Test -
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المؤلفون: R. Keirstead, P. Alvarez, K. Nichols, H.-W. Tseng, Lucy MacGregor, F. Marcy, M. Vrijlandt, F. Bolivar, J. Rappke, M. Smith, S. Bouchrara
المصدر: Proceedings.
مصطلحات موضوعية: Regional geology, Petroleum engineering, Engineering geology, Gemology, Volcanism, Economic geology, Petrology, Igneous petrology, Geobiology, Environmental geology
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::0020d107aee9cdcdc2caa604f84032caTest
https://doi.org/10.3997/2214-4609.201700906Test -
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المؤلفون: Y. J. Hu, H. W. Tseng, Y. S. Liu, C. T. Lu, Y.C. Chuang, S. L. Cheng, T. S. Huang, Cheng Yi Liu
المصدر: Acta Materialia. 61:5713-5719
مصطلحات موضوعية: Electron mobility, Materials science, Polymers and Plastics, Condensed matter physics, Metals and Alloys, Intermetallic, Electron, Epitaxy, Thermal expansion, Electronic, Optical and Magnetic Materials, Crystallography, Electrical resistivity and conductivity, Ceramics and Composites, Electric current, Anisotropy
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::daa92adc303d3895cc3d43237783a4a8Test
https://doi.org/10.1016/j.actamat.2013.06.014Test -
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المصدر: The Imaging Science Journal. 60:47-53
مصطلحات موضوعية: Pixel, business.industry, ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, Palette (computing), Pattern recognition, Histogram, Distortion, Information hiding, Media Technology, Embedding, Computer vision, Computer Vision and Pattern Recognition, Artificial intelligence, Cluster analysis, business, Histogram equalization, Mathematics
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::cdff1ec0023a78e22e09ee996048bb75Test
https://doi.org/10.1179/1743131x11y.0000000009Test -
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المؤلفون: Cheng Yi Liu, T. S. Huang, C. T. Lu, C. H. Cheng, H. W. Tseng
المصدر: Journal of Electronic Materials. 41:130-137
مصطلحات موضوعية: Morphology (linguistics), Materials science, Solid-state physics, Diffusion, Metallurgy, Nucleation, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Crystallography, Soldering, Phase (matter), Materials Chemistry, Electrical and Electronic Engineering, Ternary operation, Layer (electronics)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::f767dfb41e38124b4f15c24634c2e013Test
https://doi.org/10.1007/s11664-011-1772-0Test -
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المؤلفون: Cheng Yi Liu, H. W. Tseng, C. T. Lu, Y.C. Chuang, Y. H. Hsiao, T. S. Huang
المصدر: Journal of Electronic Materials. 39:2382-2386
مصطلحات موضوعية: Materials science, Diffusion, Metallurgy, Intermetallic, chemistry.chemical_element, Activation energy, Condensed Matter Physics, Copper, Solder matrix, Electronic, Optical and Magnetic Materials, Crystallography, Nickel, chemistry.chemical_compound, chemistry, Ternary compound, Materials Chemistry, Electrical and Electronic Engineering, Ternary operation
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::eb3cf048c9db3ae09b4651023ba10135Test
https://doi.org/10.1007/s11664-010-1339-5Test -
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المؤلفون: S. L. Cheng, H. W. Tseng, Cheng Yi Liu, Fuh-Sheng Shieu, C. T. Lu, T. S. Huang, Kuan Chih Huang, Chih Wei Chen
المصدر: Journal of Electronic Materials. 39:2403-2411
مصطلحات موضوعية: Materials science, Solid-state physics, Metallurgy, Alloy, Analytical chemistry, Calcium nitride, Substrate (electronics), engineering.material, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, Soldering, Phase (matter), Materials Chemistry, engineering, Electrical and Electronic Engineering, Electroplating, Layer (electronics)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::bb4bbf9aba649398d6f202df6da3193cTest
https://doi.org/10.1007/s11664-010-1346-6Test -
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المؤلفون: P. L. Liao, Cheng Yi Liu, Te Yuan Chung, C. T. Lu, Y. H. Hsiao, Y. C. Chuang, H. W. Tseng
المصدر: Microelectronics Reliability. 50:1159-1162
مصطلحات موضوعية: Materials science, Kirkendall effect, business.industry, Electrical engineering, Condensed Matter Physics, Electromigration, Atomic and Molecular Physics, and Optics, Cathode, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Anode, law.invention, law, Soldering, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, business, Flip chip
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::52e32a0c575543425b060e392ea3763eTest
https://doi.org/10.1016/j.microrel.2010.05.002Test