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1مؤتمر
المؤلفون: Ji, Hong-Miao, Cheemalamarri, Hemanth Kumar, Chi, Ting-Ta, Serene, Hui-ting Lim, Teo Dickson, Wei-Jie, Alfred, Siang-Kiat Neo, Li, Hong-Yu, Jon, Gim-Guan Chen, Venkataraman, Nandini, Lee, Wen
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
الإتاحة: https://doi.org/10.1109/eptc59621.2023.10457749Test
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457749.pdf?arnumber=10457749Test -
2
المؤلفون: Hongyu Li, Hong Miao Ji, Gim Guan Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K.-J. Chui
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::3f01db4d6bec3181adcdb2acce0d9202Test
https://doi.org/10.1109/eptc56328.2022.10013123Test -
3
المؤلفون: Hong Miao Ji, Gim Guan Chen, K.-J. Chui
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::e809664655c216d4e6247c8a7281ff5bTest
https://doi.org/10.1109/eptc56328.2022.10013244Test -
4
المؤلفون: Gim Guan Chen, Ying Jun Mao, Swee Kiat Eugene Tan, Ramana Murthy
المصدر: Advanced Materials Research. 254:107-110
مصطلحات موضوعية: Microelectromechanical systems, Engineering drawing, Materials science, Chemical-mechanical planarization, General Engineering, Process (computing), Polishing, Composite material, Microstructure, Wafer-level packaging, Polyimide
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::2c3ac573f3e1f82cc2f840724bcd7d80Test
https://doi.org/10.4028/www.scientific.net/amr.254.107Test -
5مؤتمر
المؤلفون: Yingjun Mao, Gim Guan Chen, Murthy, Ramana, Eugene Tan, Woon Leng Loh
المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference
الإتاحة: https://doi.org/10.1109/eptc.2011.6184524Test
http://xplorestaging.ieee.org/ielx5/6178148/6184374/06184524.pdf?arnumber=6184524Test