دورية أكاديمية

InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications

التفاصيل البيبلوغرافية
العنوان: InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications
المؤلفون: Krzysztof Gibasiewicz, Anna Kafar, Dario Schiavon, Kiran Saba, Łucja Marona, Eliana Kamińska, Piotr Perlin
المصدر: Micromachines, Vol 14, Iss 2, p 408 (2023)
بيانات النشر: MDPI AG
سنة النشر: 2023
المجموعة: Directory of Open Access Journals: DOAJ Articles
مصطلحات موضوعية: InGaN laser, Fabry–Perot, wet etching GaN, GaN TMAH, Mechanical engineering and machinery, TJ1-1570
الوصف: The main objective of this work is to demonstrate and validate the feasibility of fabricating (Al, In) GaN laser diodes with etched facets. The facets are fabricated using a two-step dry and wet etching process: inductively coupled plasma—reactive ion etching in chlorine, followed by wet etching in tetramethylammonium hydroxide (TMAH). For the dry etching stage, an optimized procedure was used. For the wet etching step, the TMAH temperature was set to a constant value of 80 °C, and the only variable parameter was time. The time was divided into individual steps, each of 20 min. To validate the results, electro-optical parameters were measured after each step and compared with a cleaved reference, as well as with scanning electron microscope imaging of the front surface. It was determined that the optimal wet etching time was 40 min. For this time, the laser tested achieved a fully comparable threshold current (within 10%) with the cleaved reference. The described technology is an important step for the future manufacturing of photonic integrated circuits with laser diodes integrated on a chip and for ultra-short-cavity lasers.
نوع الوثيقة: article in journal/newspaper
اللغة: English
تدمد: 2072-666X
العلاقة: https://www.mdpi.com/2072-666X/14/2/408Test; https://doaj.org/toc/2072-666XTest; https://doaj.org/article/5100f264e4f54e0393103b22eb4ed70cTest
DOI: 10.3390/mi14020408
الإتاحة: https://doi.org/10.3390/mi14020408Test
https://doaj.org/article/5100f264e4f54e0393103b22eb4ed70cTest
رقم الانضمام: edsbas.CF9FBFEC
قاعدة البيانات: BASE
الوصف
تدمد:2072666X
DOI:10.3390/mi14020408