المؤلفون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, J.-C., Weber, O., Turgis, D., Valery, A., Medico, S. Del, Caubet, V., Reynard, J.-P., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.

المساهمون: STMicroelectronics

المصدر: IEEE Journal of the Electron Devices Society ; volume 10, page 563-568 ; ISSN 2168-6734

مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biotechnology

الإتاحة: https://doi.org/10.1109/jeds.2022.3162755Test
http://xplorestaging.ieee.org/ielx7/6245494/9714452/09743565.pdf?arnumber=9743565Test

المؤلفون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, JC., Weber, O., Turgis, D., Valery, A., Del Medico, S., Caubet, V., Reynard, JP., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.

المساهمون: Redaelli, A., Gandolfo, A., Samanni, G., Gomiero, E., Petroni, E., Scotti, L., Lippiello, A., Mattavelli, P., Jasse, J., Codegoni, D., Serafini, A., Ranica, R., Boccaccio, C., Sandrini, J., Berthelon, R., Grenier, Jc., Weber, O., Turgis, D., Valery, A., Del Medico, S., Caubet, V., Reynard, Jp., Dutartre, D., Favennec, L., Conte, A., Disegni, F., De Tomasi, M., Ventre, A., Baldo, M., Ielmini, D., Maurelli, A., Ferreira, P., Arnaud, F., Piazza, F., Cappelletti, P., Annunziata, R., Gonella, R.

العلاقة: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-3748-6; info:eu-repo/semantics/altIdentifier/wos/WOS:000790809500054; ispartofbook:ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC); ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC); firstpage:231; lastpage:234; numberofpages:4; http://hdl.handle.net/11311/1194824Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85123399613

الإتاحة: https://doi.org/10.1109/ESSDERC53440.2021.9631807Test
http://hdl.handle.net/11311/1194824Test

المؤلفون: Ranica, R., Berthelon, R., Gandolfo, A., Samanni, G., Gomiero, E., Jasse, J., Mattavelli, P., Sandrini, J., Querre, M., Le-Friec, Y., Poulet, J., Caubet, V., Favennec, L., Boccaccio, C., Ghezzi, G., Gallon, C., Grenier, JC., Dumont, B., Weber, O., Villaret, A., Beneyton, R., Cherault, N., Ristoiu, D., Del Medico, S., Kermarrec, O., Reynard, JP., Boivin, P., Souhaite, A., Desvoivres, L., Chouteau, S., Sassoulas, PO., Clement, L., Valery, A., Petroni, E., Turgis, D., Lippiello, A., Scotti, L., Disegni, F., Ventre, A., Ornaghi, D., De Tomasi, M., Maurelli, A., Conte, A., Arnaud, F., Redaelli, A., Annunziata, R., Cappelletti, P., Piazza, F., Ferreira, P., Gonella, R.

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM)

الإتاحة: https://doi.org/10.1109/iedm19574.2021.9720669Test
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720669.pdf?arnumber=9720669Test

المؤلفون: Enrici Vaion, R., Medda, M., Mancaleoni, A., Mura, G., Pintus, A., De Tomasi, M.

المساهمون: Enrici Vaion, R., Medda, M., Mancaleoni, A., Mura, G., Pintus, A., De Tomasi, M.

مصطلحات موضوعية: Electronic, Optical and Magnetic Material, Atomic and Molecular Physics, and Optic, Condensed Matter Physic, Safety, Risk, Reliability and Quality, Surfaces, Coatings and Film, Electrical and Electronic Engineering

العلاقة: info:eu-repo/semantics/altIdentifier/wos/WOS:000414817500079; volume:76-77; firstpage:438; lastpage:443; numberofpages:6; journal:MICROELECTRONICS RELIABILITY; http://hdl.handle.net/11584/234065Test; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85024933851

الإتاحة: https://doi.org/10.1016/j.microrel.2017.07.061Test
http://hdl.handle.net/11584/234065Test

المؤلفون: Bravaix, Alain, Huard, V., Mhira, S., de Tomasi, M., Trabace, E., Vaion, R. Enrici, Zabberoni, P.

المساهمون: Yncréa Méditerrané, Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP), Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS), STMicroelectronics Crolles (ST-CROLLES), STMicroelectronics Agrate Brianza (ST-AGRATE)

المصدر: 2017 IEEE International Reliability Physics Symposium (IRPS)
https://hal.science/hal-03654298Test
2017 IEEE International Reliability Physics Symposium (IRPS), Apr 2017, Monterey, France. pp.3A-2.1-3A-2.7, ⟨10.1109/IRPS.2017.7936277⟩

مصطلحات موضوعية: reliability model, product qualification, automotive, extrinsic, screening, yield, failure rate, [SPI]Engineering Sciences [physics]

جغرافية الموضوع: Monterey, France

العلاقة: hal-03654298; https://hal.science/hal-03654298Test

الإتاحة: https://doi.org/10.1109/IRPS.2017.7936277Test
https://hal.science/hal-03654298Test

المؤلفون: Huard, V., Mhira, S., De Tomasi, M., Trabace, E., Vaion, R. Enrici, Zabberoni, P.

المصدر: 2017 IEEE International Reliability Physics Symposium (IRPS)

الإتاحة: https://doi.org/10.1109/irps.2017.7936277Test
http://xplorestaging.ieee.org/ielx7/7932684/7936242/07936277.pdf?arnumber=7936277Test

المؤلفون: De Tomasi, M., Vaion, R. Enrici, Cola, L., Zabberoni, P., Mervic, A.

المصدر: 2014 IEEE International Reliability Physics Symposium

الإتاحة: https://doi.org/10.1109/irps.2014.6861137Test
http://xplorestaging.ieee.org/ielx7/6850132/6860565/06861137.pdf?arnumber=6861137Test

المؤلفون: DEFRANCESCO, EDI, CORONELLA T, TARGA D, MONTEDORO M, DE TOMASI M.

المساهمون: VENETO AGRICOLTURA, Defrancesco, Edi, Coronella, T, Targa, D, Montedoro, M, DE TOMASI, M.

مصطلحات موضوعية: censimento agricolo

وصف الملف: STAMPA

العلاقة: ispartofbook:Rapporto 2003 sul sistema agroalimentare del veneto; firstpage:83; lastpage:136; numberofpages:54; http://hdl.handle.net/11577/1342589Test

الإتاحة: http://hdl.handle.net/11577/1342589Test

المؤلفون: De Tomasi, M., Vaion, R. E., Cola, L., Zabberoni, P., Mervic, A.

المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS)

الإتاحة: https://doi.org/10.1109/irps.2013.6532103Test
http://xplorestaging.ieee.org/ielx7/6523362/6531927/06532103.pdf?arnumber=6532103Test

المؤلفون: Cola, L., De Tomasi, M., Enrici Vaion, R., Mervic, A., Zabberoni, P.

المصدر: Microelectronics Reliability ; volume 52, issue 9-10, page 1803-1807 ; ISSN 0026-2714

مصطلحات موضوعية: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

الإتاحة: https://doi.org/10.1016/j.microrel.2012.06.086Test
https://api.elsevier.com/content/article/PII:S0026271412002831?httpAccept=text/xmlTest
https://api.elsevier.com/content/article/PII:S0026271412002831?httpAccept=text/plainTest