المؤلفون: Qu, Songtao, Shi, Qingyu

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 4, pp. 231-243.

الوصول الحر: http://www.emeraldinsight.com/doi/10.1108/SSMT-01-2023-0003Test

المؤلفون: Sung-Uk Zhang, Ogyun Seok

المصدر: Energy Reports, Vol 9, Iss , Pp 65-77 (2023)

مصطلحات موضوعية: Chip package interaction, SiC junction barrier schottky diode, Finite element analysis, Submodeling technique, Response surface method, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

العلاقة: http://www.sciencedirect.com/science/article/pii/S2352484723002135Test; https://doaj.org/toc/2352-4847Test

الوصول الحر: https://doaj.org/article/7402e7a574e6488ea231c649ff2440ddTest

المؤلفون: Ganglong Li, Yidian Shi, Andrew A. O. Tay, Zhilin Long

المصدر: Micromachines, Vol 14, Iss 10, p 1953 (2023)

مصطلحات موضوعية: reliability, chip-package interaction, delamination, thermal stress, competitive failure, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

العلاقة: https://www.mdpi.com/2072-666X/14/10/1953Test; https://doaj.org/toc/2072-666XTest

الوصول الحر: https://doaj.org/article/aec6f7295ed64fff9d58814899309278Test

المؤلفون: Tae-Kyun Kim, Jong-Gwan Yook, Joo-Yong Kim, Yong-Ho Cho, Uh-Hyeon Lee

المصدر: Sensors; Volume 23; Issue 14; Pages: 6350

مصطلحات موضوعية: coaxial socket, 3D MEMS structure, high-speed testing, chip package test, impedance matching

وصف الملف: application/pdf

العلاقة: Electronic Sensors; https://dx.doi.org/10.3390/s23146350Test

الإتاحة: https://doi.org/10.3390/s23146350Test

المؤلفون: Qinghua Wang, Shien Ri

المصدر: Theoretical and Applied Mechanics Letters, Vol 12, Iss 1, Pp 100327- (2022)

مصطلحات موضوعية: Displacement measurement, Strain distribution, Bridge, Flip chip package, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

العلاقة: http://www.sciencedirect.com/science/article/pii/S2095034922000071Test; https://doaj.org/toc/2095-0349Test

الوصول الحر: https://doaj.org/article/74a6cbaa23aa40c09f2cd7c9be22975aTest

المؤلفون: Inn-Yeal Oh

المصدر: Electronics; Volume 11; Issue 19; Pages: 3132

مصطلحات موضوعية: 3D beamforming, dual polarization, package, AiP, antenna, CMOS, flip-chip package

وصف الملف: application/pdf

العلاقة: Semiconductor Devices; https://dx.doi.org/10.3390/electronics11193132Test

الإتاحة: https://doi.org/10.3390/electronics11193132Test

المؤلفون: Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang

المصدر: IEEE Access, Vol 7, Pp 95305-95313 (2019)

مصطلحات موضوعية: Power integrity (PI), multi-domain coupling, high-speed memory, power delivery system, power distribution network (PDN), chip-package-PCB coanalysis, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

العلاقة: https://ieeexplore.ieee.org/document/8763973Test/; https://doaj.org/toc/2169-3536Test

الوصول الحر: https://doaj.org/article/09d0908441da4713a7c0ef331448f418Test

المؤلفون: Hsien-Chie Cheng, Ling-Ching Tai, Yan-Cheng Liu

المصدر: Materials; Volume 14; Issue 17; Pages: 4816

مصطلحات موضوعية: flip chip package on package, finite element analysis, viscoelastic behavior, process-induced warpage, trace mapping, effective modeling

وصف الملف: application/pdf

العلاقة: Materials Simulation and Design; https://dx.doi.org/10.3390/ma14174816Test

الإتاحة: https://doi.org/10.3390/ma14174816Test

المؤلفون: Ming-Yi Tsai, Yu-Wen Wang, Chia-Ming Liu

المصدر: Materials; Volume 14; Issue 13; Pages: 3723

مصطلحات موضوعية: flip-chip package, 2.5D package, thermal warpage, strain gauge

وصف الملف: application/pdf

العلاقة: Materials Simulation and Design; https://dx.doi.org/10.3390/ma14133723Test

الإتاحة: https://doi.org/10.3390/ma14133723Test

المؤلفون: Fischbach, Robert, Horst, Tilman, Lienig, Jens

مصطلحات موضوعية: assembly-related chip/package co-design, heterogeneous integration on package-level, micro-transfer printing, economical cost function, manufacturing costs, wafer utilization, maximum independent set problem

العلاقة: info:eu-repo/grantAgreement/EC/H2020/737465/; https://zenodo.org/record/3234391Test; https://doi.org/10.5281/zenodo.3234391Test; oai:zenodo.org:3234391

الإتاحة: https://doi.org/10.5281/zenodo.3234391Test
https://doi.org/10.23919/DATE.2019.8714884Test
https://doi.org/10.5281/zenodo.3234390Test
https://zenodo.org/record/3234391Test