المؤلفون: Fan, Yonggang^1,2 (AUTHOR) fanyonggang@smm.neu.edu.cn, Li, Kenan^1,2 (AUTHOR)

المصدر: Ceramics International. Jul2024:Part B, Vol. 50 Issue 13, p24894-24900. 7p.

مصطلحات موضوعية: *INTERFACIAL reactions, *COPPER-tin alloys, *FILLER metal, *COPPER, *INTERFACIAL bonding, *WEAR resistance

المؤلفون: Malmir, Narges¹ (AUTHOR), Alizadeh, Morteza¹ (AUTHOR) Alizadeh@sutech.ac.ir, Pashangeh, Shima² (AUTHOR) s.pashangeh@yu.ac.ir, Moghaddam, Ahmad Ostovari³ (AUTHOR)

المصدر: Archives of Civil & Mechanical Engineering (Elsevier Science). Jul2024, Vol. 24 Issue 3, p1-18. 18p.

مصطلحات موضوعية: *COPPER-tin alloys, *COPPER, *INTERMETALLIC compounds, *TENSILE tests, *FRACTURE strength, *SURFACE resistance

المؤلفون: Ren, Naiqing¹ (AUTHOR), Wang, Lifeng¹ (AUTHOR), Li, Xiaoying¹ (AUTHOR), Cao, Kuo¹ (AUTHOR), He, Zixu¹ (AUTHOR), Shao, Yu² (AUTHOR), Xiao, Jingchao^1,3 (AUTHOR), Zhu, Yiran¹ (AUTHOR), Pan, Bicai³ (AUTHOR), Jiao, Shuhong¹ (AUTHOR), Chen, Chunhua¹ (AUTHOR) cchchen@ustc.edu.cn

المصدر: Advanced Functional Materials. 6/6/2024, Vol. 34 Issue 23, p1-11. 11p.

مصطلحات موضوعية: *COPPER-tin alloys, *COPPER, *ELECTROLESS plating, *NICKEL-plating, *SOLID electrolytes, *DENDRITIC crystals, *INTERMETALLIC compounds

المؤلفون: Patil, Rhishikesh Mahadev¹ (AUTHOR), Mondal, Rohit¹ (AUTHOR), Babujani, Shaik¹ (AUTHOR), Chandra, Gali Hema¹ (AUTHOR) ghchandra@phy.vnit.ac.in, Subbaiah, Yerva Pedda Venkata² (AUTHOR), Gupta, Mukul³ (AUTHOR), Prasada Rao, Rayavarapu⁴ (AUTHOR)

المصدر: Physica Status Solidi (B). Jun2024, Vol. 261 Issue 6, p1-11. 11p.

مصطلحات موضوعية: *THIN films, *COPPER-tin alloys, *X-ray photoelectron spectroscopy, *COPPER, *SCANNING electron microscopes, *RAPID thermal processing

المؤلفون: Eid, E. A.¹ (AUTHOR) dr_eid_hti@yahoo.com, Fawzy, A.² (AUTHOR), Mansour, M. M.² (AUTHOR), Saad, G.² (AUTHOR), Amin, M.³ (AUTHOR)

المصدر: Journal of Thermal Analysis & Calorimetry. May2024, Vol. 149 Issue 10, p4313-4331. 19p.

مصطلحات موضوعية: *COPPER-tin alloys, *LEAD-free solder, *SOLDER & soldering, *TIN alloys, *THERMAL diffusivity, *GIBBS' free energy, *NUCLEAR energy

المؤلفون: Li, Yu-Ju¹ (AUTHOR) uriath0115@gmail.com, Yen, Yee-Wen^2,3 (AUTHOR) ywyen@mail.ntust.edu.tw, Chen, Chih-Ming¹ (AUTHOR) chencm@nchu.edu.tw

المصدر: Materials (1996-1944). May2024, Vol. 17 Issue 9, p2149. 15p.

مصطلحات موضوعية: *SOLDER joints, *COPPER-tin alloys, *COPPER, *LEAD-free solder, *SOLDER & soldering, *INTERFACIAL reactions

المؤلفون: Tran, Dinh-Phuc¹ (AUTHOR) trandinhphuc1508@gmail.com, Liu, Yu-Ting¹ (AUTHOR), Chen, Chih¹ (AUTHOR) chihchen@nycu.edu.tw

المصدر: Materials (1996-1944). May2024, Vol. 17 Issue 9, p2004. 13p.

مصطلحات موضوعية: *COPPER-tin alloys, *COPPER, *MICROSTRUCTURE, *SINTERING, *INTERMETALLIC compounds, *POWDERS

المؤلفون: Laksono, Andromeda Dwi¹ (AUTHOR) andromeda@lecturer.itk.ac.id, Chen, Chih-Ming² (AUTHOR) chencm@dragon.nchu.edu.tw, Yen, Yee-Wen³ (AUTHOR) ywyen@mail.ntust.edu.tw

المصدر: Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 1, p30-38. 9p.

مصطلحات موضوعية: INTERFACIAL reactions, COPPER-tin alloys, ELECTRON probe microanalysis, COPPER alloys, INTERMETALLIC compounds, SCANNING electron microscopes, TITANIUM alloys, COPPER-zinc alloys

المؤلفون: Chen, Kuan-Jen¹ (AUTHOR) kjchen@stust.edu.tw, Hung, Fei-Yi² (AUTHOR) a850425a850425@gmail.com, Liao, Hsien-Ching² (AUTHOR)

المصدر: Materials (1996-1944). Mar2024, Vol. 17 Issue 5, p995. 11p.

مصطلحات موضوعية: *SOLID state batteries, *COPPER-tin alloys, *SILICATE minerals, *ELECTRODE performance, *SOLID electrolytes, *ELECTROCHEMICAL electrodes, *INTERMETALLIC compounds

المؤلفون: Gao, Xing¹ (AUTHOR) 18852895442@163.com, Zhang, Z.J.¹ (AUTHOR) zjzhang@just.edu.cn, Wei, Hong¹ (AUTHOR) 1417502362@qq.com, Zhou, Xu¹ (AUTHOR) 1009710324@qq.com, Shi, Quan¹ (AUTHOR) 1079123597@qq.com, Wu, Yang² (AUTHOR) wuyang_0301@163.com, Chen, Lei Da² (AUTHOR) chenld1982@sina.com

المصدر: Microelectronics International. 2024, Vol. 41 Issue 1, p9-15. 7p.

مصطلحات موضوعية: *COPPER-tin alloys, *SOLDER joints, *COPPER, *SOLDER & soldering, *INTERFACIAL reactions, *TIN