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1مؤتمر
المؤلفون: Chan, Mu Hsuan, Chuang, Chris, Huang, Yu Lung, Chen, Wei Jhen, Jiang, Don Son, Huang, C.M., Chung, C. Key
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
الإتاحة: https://doi.org/10.1109/ectc32696.2021.00087Test
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501838.pdf?arnumber=9501838Test -
2مؤتمر
المؤلفون: Lia, Jay, Tsai, Fang-Lin, Li, Jackson, Pan, George, Chan, Mu-Hsuan, Zheng, Louise, Chen, Steven, Kao, Nicholas, Lai, David, Wan, Katch, Wang, Yu-Po
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
الإتاحة: https://doi.org/10.1109/eptc53413.2021.9663974Test
http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663974.pdf?arnumber=9663974Test -
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4
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5مؤتمر
المؤلفون: Chan, Mu-Hsuan, Hsue, Brock, Lin, Chun-Tang, Chiu, Steve, Wang, Yu-Po
المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
الإتاحة: https://doi.org/10.1109/ectc.2015.7159746Test
http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159746.pdf?arnumber=7159746Test -
6مؤتمر
المؤلفون: Chi, Chieh-Yuan, Lin, Chun-Tang, Huang, Jung-Pang, Chan, Mu-Hsuan, Liao, Yan-Yi, Chen, Yan-Heng, Chen, Wei-Yu
المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
الإتاحة: https://doi.org/10.1109/impact.2013.6706649Test
http://xplorestaging.ieee.org/ielx7/6698269/6706610/06706649.pdf?arnumber=6706649Test -
7مؤتمر
المؤلفون: Huang, Huei-Nuan, Lee, Mei-Chin, Yeh, Chi-Tung, Lee, Pai-Yuan, Chan, Mu-Hsuan, Lin, Chun-Tang, Chiu, Steve, Ma, Mike
المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
الإتاحة: https://doi.org/10.1109/impact.2013.6706694Test
http://xplorestaging.ieee.org/ielx7/6698269/6706610/06706694.pdf?arnumber=6706694Test -
8مؤتمر
المؤلفون: Yeh, Chi-Tung, Huang, Huei-Nuan, Lee, Pai-Yuan, Chan, Mu-Hsuan, Lin, G. T., Chiu, Steve
المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
الإتاحة: https://doi.org/10.1109/impact.2013.6706678Test
http://xplorestaging.ieee.org/ielx7/6698269/6706610/06706678.pdf?arnumber=6706678Test -
9مؤتمر
المؤلفون: Lee, Pai-Yuan, Yeh, Chi-Tung, Huang, Huei-Nuan, Chan, Mu-Hsuan, Lin, Chun-Tang, Chiu, Steve, Ma, Mike
المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
الإتاحة: https://doi.org/10.1109/impact.2013.6706679Test
http://xplorestaging.ieee.org/ielx7/6698269/6706610/06706679.pdf?arnumber=6706679Test -
10مؤتمر
المؤلفون: Chan, Mu-Hsuan, Liao, Yi-Chian, Lin, Chun-Tang, Chuang, Kuan-Weir, Huang, Huei-Nuan, Yeh, Chi-Tung, Tseng, Wen-Tsung, Lai, Jeng-Yuan
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference
الإتاحة: https://doi.org/10.1109/ectc.2013.6575880Test
http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575880.pdf?arnumber=6575880Test