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المؤلفون: C. Marsan-Loyer, C. Sansregret
المصدر: International Symposium on Microelectronics. 2019:000609-000613
مصطلحات موضوعية: Flexibility (engineering), Computer science, Bond, Printed electronics, Automotive Engineering, Electronic engineering, Reliability (statistics), Domain (software engineering)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::4f8c2c35291f2452079a535a6109fdf7Test
https://doi.org/10.4071/2380-4505-2019.1.000609Test -
2
المؤلفون: T. Dequivre, C. Marsan-Loyer
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:557-561
مصطلحات موضوعية: Materials science, Rework, Temperature cycling, Epoxy, Industrial and Manufacturing Engineering, Electrical connection, Electronic, Optical and Magnetic Materials, Electrical resistance and conductance, visual_art, Ball (bearing), visual_art.visual_art_medium, Effective method, Electrical and Electronic Engineering, Composite material, Electrical conductor
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::5c4ea9df9a161b54d811a1739cb5c34bTest
https://doi.org/10.1109/tcpmt.2018.2878104Test -
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المؤلفون: C. Marsan-Loyer, D. Danovitch, N. Boyer
المصدر: Journal of Microelectronics and Electronic Packaging. 14:32-38
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::dfaac89a4d7a3d03816b8f1c477ac42cTest
https://doi.org/10.4071/imaps.348081Test -
4
المؤلفون: D. Danovitch, N. Boyer, C. Marsan-Loyer
المساهمون: Université de Sherbrooke (UdeS), Laboratoire Nanotechnologies Nanosystèmes (LN2 ), Université Grenoble Alpes [2016-2019] (UGA [2016-2019])-École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Université de Sherbrooke (UdeS)-École supérieure de Chimie Physique Electronique de Lyon (CPE)-Centre National de la Recherche Scientifique (CNRS), Institut Interdisciplinaire d'Innovation Technologique [Sherbrooke] (3IT), IBM Canada
المصدر: International Symposium on Microelectronics
International Symposium on Microelectronics, 2016, 2016 (1), pp.000054-000059. ⟨10.4071/isom-2016-TP25⟩مصطلحات موضوعية: Interconnection, Engineering, business.industry, 020208 electrical & electronic engineering, Flux, 020206 networking & telecommunications, Nanotechnology, 02 engineering and technology, Thermocompression bonding, Integrated circuit, Engineering physics, Die (integrated circuit), law.invention, Semiconductor industry, [SPI]Engineering Sciences [physics], law, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, Ultra fine, business, ComputingMilieux_MISCELLANEOUS
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e5856ef286dcc957d3f86c3373b73fdbTest
https://doi.org/10.4071/isom-2016-tp25Test