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1
المؤلفون: Hongyu Li, Hong Miao Ji, Gim Guan Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K.-J. Chui
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::3f01db4d6bec3181adcdb2acce0d9202Test
https://doi.org/10.1109/eptc56328.2022.10013123Test -
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المؤلفون: H. Y. Li, Hong Miao Ji, Alfred Neo Siang Kiat, Masaya Kawano
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::737ac6228636d2dd0f8c439cfcc09867Test
https://doi.org/10.1109/eptc53413.2021.9663937Test