المؤلفون: Palagud, Jose, Wang, S W

المصدر: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference

الإتاحة: https://doi.org/10.1109/iemt.2016.7761948Test
http://xplorestagingTest.ieee.org/ielx7/7746813/7761905/07761948.pdf?arnumber=7761948

المؤلفون: De Jesus, Edsel, Wang, S W

المصدر: 36th International Electronics Manufacturing Technology Conference

الإتاحة: https://doi.org/10.1109/iemt.2014.7123115Test
http://xplorestagingTest.ieee.org/ielx7/7113953/7123067/07123115.pdf?arnumber=7123115

المؤلفون: Palagud, Jose, Wang, S W

المصدر: 36th International Electronics Manufacturing Technology Conference

الإتاحة: https://doi.org/10.1109/iemt.2014.7123104Test
http://xplorestagingTest.ieee.org/ielx7/7113953/7123067/07123104.pdf?arnumber=7123104

المؤلفون: Chang, S. W., Li, Xu, Oxland, R., Wang, S. W., Wang, C. H., Contreras-Guerrero, R., Bhuwalka, K. K., Doornbos, G., Vasen, T., Holland, M. C., Vellianitis, G., van Dal, M. J. H., Duriez, B., Edirisooriya, M., Rojas-Ramirez, J. S, Ramvall, P., Thoms, S., Peralagu, U., Hsieh, C. H., Chang, Y. S., Yin, K. M., Lind, E., Wernersson, L.-E., Droopad, R., Thayne, I., Passlack, M., Diaz, C. H.

المصدر: 2013 IEEE International Electron Devices Meeting

الإتاحة: https://doi.org/10.1109/iedm.2013.6724639Test
http://xplorestagingTest.ieee.org/ielx7/6709840/6724533/06724639.pdf?arnumber=6724639

المؤلفون: Kong, T.-H., Woo, Y.-J., Wang, S.-W., Hong, S.-W., Cho, GH Cho, Gyu-Hyeong

الإتاحة: http://hdl.handle.net/10203/164404Test

المؤلفون: Wang, S.-W., Woo, Y.-J., Yuk, Y.-S., Lee, B., Cho, G.-H., Cho, GH Cho, Gyu-Hyeong

الإتاحة: http://hdl.handle.net/10203/164238Test

المؤلفون: Lee, B., Lee, K.-H., Lee, J.-O., Sohn, M.-J., Choi,S.-H., Wang, S.-W., Yoon, JB Yoon, Jun-Bo, Cho, GH Cho, Gyu-Hyeong

الإتاحة: http://hdl.handle.net/10203/166847Test

المؤلفون: Wang, S.-W., Woo, Y.-J., Yuk, Y.-S., Cho, GH Cho, Gyu-Hyeong, Cho, G.-H.

الإتاحة: http://hdl.handle.net/10203/164532Test

المؤلفون: Yang, H. -H., Wang, S. -W., Ko, H. -T., Lin, J. -C.

المصدر: 2009 IEEE International Conference on Industrial Engineering and Engineering Management

الإتاحة: https://doi.org/10.1109/ieem.2009.5373151Test
http://xplorestagingTest.ieee.org/ielx5/5356752/5372873/05373151.pdf?arnumber=5373151

المؤلفون: Tseng, S. -Y., Kuo, J. -S., Wang, S. -W., Hsieh, C. -T.

المصدر: 2007 IEEE Power Electronics Specialists Conference

الإتاحة: https://doi.org/10.1109/pesc.2007.4341977Test
http://xplorestagingTest.ieee.org/ielx5/4341939/4341940/04341977.pdf?arnumber=4341977